Director, Advanced Packaging Disruptive Technology (Based in Singapore)

Location: Singapore; candidate must be willing to relocate. Travel required at approximately 20–25% for customer engagement, ecosystem collaboration, and industry events.

Company

hirify.global develops materials engineering solutions, equipment, and services used to manufacture semiconductor chips and advanced displays.

What you will do

• Define and execute N+2 and beyond pathfinding roadmaps for advanced packaging, including integration, interconnect, materials, and architecture inflections.
• Lead concept incubation, feasibility exploration, rapid prototyping, and evaluation of disruptive packaging approaches such as D2W, RDL, CoWoS, TSV, heterogeneous integration, and advanced substrates.
• Build, lead, mentor, and develop a world-class exploratory R&D and innovation team.
• Translate customer roadmaps, system architecture trends, and market needs into technology strategies, product concepts, and differentiated platforms.
• Build partnerships across materials suppliers, substrate vendors, OSATs, foundries, equipment partners, research institutions, and industry consortia.
• Establish governance and executive decision frameworks to transition pathfinding concepts into development pipelines and scale validated learnings.

Requirements

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies, including D2W, RDL, CoWoS, and TSV, with the ability to develop approaches beyond existing paradigms.
• Proven experience building and leading cross-functional or exploratory R&D teams.
• Ability to translate complex technology concepts into business impact and strategic direction.
• Willingness to relocate to Singapore.

Nice to have

• Advanced degree such as a PhD or MS in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related field.
• Track record of delivering disruptive or first-of-a-kind technology solutions.
• Experience in heterogeneous integration, chiplet ecosystems, or next-generation packaging architectures.
• Strong network across industry ecosystems and research communities.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Environment encourages innovation, experimentation, calculated risk-taking, collaboration, and accountability.
• Employee health and wellbeing programs support personal and professional growth.
• Regular employment with relocation eligibility.