Назад
Company hidden
обновлено 1 день назад

Electrical New Product Engineering (ENPIE) (Advanced SMT/PCB)

130 000 - 165 000$
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/
TL;DR
Electrical New Product Engineering (ENPIE) (Advanced SMT/PCB): Driving new product introduction for advanced SMT PCAs and high-layer-count PCB designs with an accent on design for manufacturability, reliability, quality, and production readiness. Focus on optimizing BGA assembly, validating processes, resolving manufacturing failures, managing product lifecycles and ECOs, and improving yield, cost, and scalability.

Location: Santa Clara, CA, USA

Base pay: $130,000–$165,000 per year, plus potential discretionary bonuses and equity.

Company

hirify.global develops client-to-cloud networking solutions for data centers, campuses, and routing environments, using cloud computing, artificial intelligence, and software-defined networking.

What you will do

  • Drive PCA designs from development through high-volume production readiness.
  • Identify and resolve DFM issues in SMT assembly and system integration.
  • Optimize high-layer-count PCB manufacturing and BGA assembly processes.
  • Lead process validation, troubleshooting, failure analysis, and root-cause investigations.
  • Manage NPI lifecycles from prototypes through full production, including ECOs and PLM version control.
  • Coordinate with engineering, product operations, supply chain, and contract manufacturing partners to improve yield, cost, quality, and inventory efficiency.

Requirements

  • BS or MS degree in Electrical Engineering or Manufacturing Engineering.
  • 5–7+ years of NPI engineering experience focused on advanced SMT and high-layer-count PCB assembly; 30+ layers preferred.
  • Strong experience with circuit debugging, troubleshooting, failure and root-cause analysis, and 8D methodology.
  • Comprehensive knowledge of DFx practices, including DFM, DFR, DFT, DFC, and DFQ.
  • Proficiency with PLM systems such as Propel or Agile, including ECO, MCO, DEV, and PCN processes.
  • Experience with product lifecycle management, BOM risk assessment, second sourcing, component qualification, technical mentorship, and cross-functional collaboration.

Nice to have

  • PCA design and layout experience.

Culture & Benefits

  • Collaborative work across hardware engineering, ECAD, mechanical and thermal engineering, product operations, supply chain, and contract manufacturing.
  • Work on high-performance, high-layer-count networking products and advanced manufacturing processes.
  • US-based employees receive medical, dental, vision, wellbeing, tax savings, and income protection benefits.
  • Additional compensation may include discretionary bonuses and equity.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →