2 дня назад
Ocotillo Technology Fabrication Yield Defect Metrology Module Team Leader (Semiconductor Manufacturing)
120 860 - 231 670$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Ocotillo Technology Fabrication Yield Defect Metrology Module Team Leader (Semiconductor Manufacturing): Leading engineers and technicians responsible for defect metrology, wafer fabrication yield, and factory performance in an Arizona technology fabrication site with an accent on safety, quality, yield improvement, training, and employee relations. Focus on driving roadmap execution, solving semiconductor process and equipment issues, analyzing yield data, and leading cross-functional teams toward high-performance results.
Location: On-site in Phoenix, Arizona, United States
Annual salary: $120,860–$231,670 USD
Company
operates the Ocotillo Technology Fabrication site and develops and manufactures semiconductor technologies.
What you will do
- Lead the Yield Defect Metrology Layer Owner Module team at the Ocotillo Technology Fabrication site.
- Manage the performance, development, and employee relations of engineers and technicians.
- Partner with Yield, Process Engineering, and Production leaders to maintain consistent results across functional areas.
- Drive the roadmap for safety, quality, yield improvement, training, and employee-relations metrics.
- Lead factory improvements for a key yield vector and influence cross-functional stakeholders across the fabrication organization.
- Set behavioral and performance standards while modeling the site culture.
Requirements
- Bachelor’s degree in Electrical Engineering, Microelectronics Engineering, Materials Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics, or a related field, plus 7+ years of process or yield engineering management experience in wafer fabrication.
- Alternatively, a Master’s or Ph.D. degree in a relevant field plus 5+ years of process or yield engineering management experience in wafer fabrication.
- Knowledge of process flows and equipment troubleshooting.
- Model-based problem-solving, semiconductor processing expertise, and data analysis skills.
- Strong communication, ownership, prioritization, problem-solving, teamwork, feedback, and leadership skills.
- On-site presence in the United States is required. US citizenship is required to obtain and maintain the specified security clearance.
Nice to have
- Active US Government TS Security Clearance with SCI access, or the ability to obtain and maintain one.
- Technical experience in a Yield group.
- Previous experience as a Group Leader, Module Team Leader, Area Manager, or leader of high-performing technical teams.
Culture & Benefits
- Full-time experienced-hire position on Shift 1.
- Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
- High-performance team culture with clear expectations, accountability, urgency, and continuous improvement.
- Commitment to responsible business practices and ethical hiring.
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