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2 дня назад

Ocotillo Technology Fabrication Yield Defect Metrology Module Team Leader (Semiconductor Manufacturing)

120 860 - 231 670$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Мэтч & Сопровод

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Описание вакансии

Текст:
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TL;DR
Ocotillo Technology Fabrication Yield Defect Metrology Module Team Leader (Semiconductor Manufacturing): Leading engineers and technicians responsible for defect metrology, wafer fabrication yield, and factory performance in an Arizona technology fabrication site with an accent on safety, quality, yield improvement, training, and employee relations. Focus on driving roadmap execution, solving semiconductor process and equipment issues, analyzing yield data, and leading cross-functional teams toward high-performance results.

Location: On-site in Phoenix, Arizona, United States

Annual salary: $120,860–$231,670 USD

Company

hirify.global operates the Ocotillo Technology Fabrication site and develops and manufactures semiconductor technologies.

What you will do

  • Lead the Yield Defect Metrology Layer Owner Module team at the Ocotillo Technology Fabrication site.
  • Manage the performance, development, and employee relations of engineers and technicians.
  • Partner with Yield, Process Engineering, and Production leaders to maintain consistent results across functional areas.
  • Drive the roadmap for safety, quality, yield improvement, training, and employee-relations metrics.
  • Lead factory improvements for a key yield vector and influence cross-functional stakeholders across the fabrication organization.
  • Set behavioral and performance standards while modeling the site culture.

Requirements

  • Bachelor’s degree in Electrical Engineering, Microelectronics Engineering, Materials Science Engineering, Chemical Engineering, Mechanical Engineering, Optical Engineering, Statistics/Data Science, Chemistry, Physics, or a related field, plus 7+ years of process or yield engineering management experience in wafer fabrication.
  • Alternatively, a Master’s or Ph.D. degree in a relevant field plus 5+ years of process or yield engineering management experience in wafer fabrication.
  • Knowledge of process flows and equipment troubleshooting.
  • Model-based problem-solving, semiconductor processing expertise, and data analysis skills.
  • Strong communication, ownership, prioritization, problem-solving, teamwork, feedback, and leadership skills.
  • On-site presence in the United States is required. US citizenship is required to obtain and maintain the specified security clearance.

Nice to have

  • Active US Government TS Security Clearance with SCI access, or the ability to obtain and maintain one.
  • Technical experience in a Yield group.
  • Previous experience as a Group Leader, Module Team Leader, Area Manager, or leader of high-performing technical teams.

Culture & Benefits

  • Full-time experienced-hire position on Shift 1.
  • Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • High-performance team culture with clear expectations, accountability, urgency, and continuous improvement.
  • Commitment to responsible business practices and ethical hiring.

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