Senior Testchip SoC Physical Design Engineer (Integration & Methodology)

TL;DR

Senior Testchip SoC Physical Design Engineer (Semiconductors): Developing layout design methodologies and driving full-chip SoC integration for cutting-edge testchip vehicles with an accent on physical design convergence and hierarchical layout specifications. Focus on solving complex layout constraints in advanced process nodes and ensuring high-quality, scalable solutions for manufacturing readiness.

Location: Hybrid (US: Hillsboro, Santa Clara, or Austin)

Salary: $141,910 – $200,340 USD

Company

hirify.global is a global leader in semiconductor innovation, focusing on the design and manufacturing of advanced chips for computing and data processing.

What you will do

• Develop layout design methodologies for testchip development in next-generation process nodes.
• Define critical design features in collaboration with Process Integration, Yield, and QnR teams.
• Establish and maintain hierarchical layout design specifications for correct-by-construction integration.
• Drive physical design convergence, prepare layout hierarchy for design tape-in, and resolve verification tool issues.
• Collaborate with tool owners and vendors to drive continuous improvement in layout productivity and efficiency.

Requirements

• Master's degree in Electrical Engineering or a related field.
• Minimum 5 years of experience in physical/layout design within advanced technology nodes.
• Proficiency in layout design tools such as Cadence Virtuoso Suite or Synopsys Custom Compiler.
• Experience with floorplanning, hierarchical design integration, and layout verification/debug.
• Must be based in the United States (specifically Oregon, California, or Texas).

Nice to have

• Experience in defining Testchip/Product design from concept to execution commit.
• Proven project management skills in coordinating the entire design cycle up to final tape-in.
• Previous work experience within a semiconductor foundry.

Culture & Benefits

• Hybrid work model allowing a split between on-site and off-site work.
• Competitive compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunities for technical leadership and career growth within an industry-leading expert environment.