Process Engineer (Semiconductor)

TL;DR

Process Engineer (Semiconductor): Managing end-to-end process and equipment performance for Die Bond and Wire Bond stations in a high-volume Reel-to-Reel assembly line with an accent on yield improvement, equipment uptime, and process stability. Focus on conducting root cause analysis, optimizing bonding parameters, and leading new product introductions to ensure quality excellence.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a global semiconductor manufacturer specializing in high-volume production of essential components.

What you will do

• Own and sustain Die Attach and Wire Bond processes and equipment to ensure stable operation and high OEE.
• Manage tooling setup, calibration, and qualification activities for production lines.
• Conduct DOE, FMEA, and root cause analysis to resolve yield and quality issues.
• Optimize bonding parameters and validate process capability for new and existing products.
• Lead new product introduction (NPI) activities including setup and material qualification.
• Analyze manufacturing data to drive continuous improvement and cost reduction projects.

Requirements

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or related engineering disciplines.
• 2–3 years of hands-on experience in Die Bond and/or Wire Bond process and equipment support.
• Strong understanding of R2R assembly lines and high-volume production environments.
• Proficiency in DOE, FMEA, SPC, 8D, and structured problem-solving methods.
• Ability to analyze manufacturing data using tools like Excel, Spotfire, or Power BI.
• Solid understanding of OEE, yield improvement, and process capability (Cpk).

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups.
• Focus on professional development and technical mentoring.
• Support for women in management initiatives.
• Safe and inclusive work environment with reasonable adjustments provided.