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11 дней назад

Process Integration Development Engineer (Semiconductors)

120 860 - 231 670$
Формат работы
hybrid
Тип работы
fulltime
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

Текст:
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TL;DR

Process Integration Development Engineer (Semiconductors): Driving technology transfers, process integration, and yield/defect improvements in semiconductor manufacturing with an accent on defect metrology, statistical root-cause analysis, and continuous improvement. Focus on designing and executing experiments, building process module flow/configurations, and leading quality risk assessments to improve line yield and sort yield in startup and high-volume environments.

Company

hirify.global develops semiconductor technologies and manufacturing solutions for advanced computing.

What you will do

  • Perform detailed data analysis using statistical/data mining tools to identify root causes of defect and yield issues.
  • Lead low-yield analysis and yield improvement activities, defining roadmaps for incoming technology transfers.
  • Design and implement continuous improvement initiatives to prevent quality, line yield, and sort yield excursions.
  • Develop and establish flow, procedures, and equipment configurations for process modules.
  • Design, execute, and analyze experiments to meet engineering specifications for process modules.
  • Conduct quality and reliability risk assessments for discrepant manufacturing materials and process changes.

Requirements

  • Ph.D. with 4+ years of semiconductor industry experience OR Master’s with 6+ years of semiconductor process and yield engineering experience in a relevant STEM field.
  • Experience in semiconductor processing/fabrication (e.g., lithography, etch, CMP, thin films, plating) and/or Statistical Process Control and Design of Experiments (DOE).
  • Data analysis experience using JMP/JSL and Python.
  • Experience in defect inspection/review or metrology techniques used in semiconductor manufacturing.
  • Ability to lead technical projects and mentor team members.

Culture & Benefits

  • Hybrid work model: split time between on-site at the assigned hirify.global site and off-site.
  • Total compensation package includes competitive pay, stock bonuses, and benefits (health, retirement, vacation).
  • Annual salary range for US-located roles: $120,860.00–$231,670.00 USD.

Hiring process

  • Application review followed by interviews as part of the hiring process.
  • Recruiter shares location-specific compensation details during the hiring process.

Location: US, Oregon, Hillsboro

Salary: $120,860.00–$231,670.00 USD (annual)

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