Principal/Master Engineer (Silicon Photonics)

TL;DR

Principal/Master Engineer (Silicon Photonics): Leading advanced packaging and assembly development for a scalable silicon photonics platform with an accent on 2.5D/3D integration and volume manufacturing. Focus on driving DFM decisions, managing OSAT partners, and optimizing yield for high-performance optical products.

Location: Must be based in San Jose, California, USA

Salary: $167,500 – $268,000

Company

hirify.global is a global technology leader that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions.

What you will do

• Lead advanced packaging design, substrate definition, and assembly process development.
• Collaborate with PIC, IC, and opto-mechanical teams to align package architectures with electrical, optical, and thermal requirements.
• Manage external OSAT partners to pioneer wafer- and chip-scale assembly processes.
• Define and enforce packaging specifications and design rules.
• Troubleshoot complex assembly issues and drive yield optimization from NPI to volume production.
• Evaluate and deploy next-generation 2.5D/3D packaging technologies.

Requirements

• MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or Optical Physics.
• 15+ years of hands-on experience in semiconductor advanced packaging or silicon photonics assembly.
• Deep understanding of 2.5D/3D integration techniques and their application to photonics.
• Proven track record of developing high-yielding optical products.
• Operational experience managing OSATs/CMs and directing yield engineering.
• Exceptional problem-solving skills and decisive technical leadership.

Culture & Benefits

• Competitive base salary with discretionary annual bonus.
• New hire equity grant and annual equity awards.
• Comprehensive medical, dental, and vision plans.
• 401(k) participation with company matching.
• Employee Stock Purchase Program (ESPP).
• Paid holidays, sick leave, and vacation time.