Assistant/Associate Professor Advanced Packaging and Heterogeneous Integration (Semiconductors)

TL;DR

Assistant/Associate Professor Advanced Packaging and Heterogeneous Integration (Semiconductors): Leading a world-class research program in advanced semiconductor packaging and system integration with an accent on chiplet architectures, 3D integration, and thermal management. Focus on bridging fundamental science with industrial applications to shape the future of AI, high-performance computing, and sustainable electronic systems.

Location: Must be based in or relocate to Delft, Netherlands

Salary: €4,728 – €8,673 per month gross

Company

Delft University of Technology (hirify.global) is a leading international research university dedicated to engineering solutions for global challenges in energy, climate, and digitalization.

What you will do

• Develop and lead an internationally visible research program in advanced packaging and heterogeneous integration.
• Provide scientific leadership and contribute to the strategic direction of the Electronic Components, Technology and Materials (ECTM) section.
• Acquire substantial competitive research funding from national and European sources.
• Build and expand collaborations with leading semiconductor companies and research institutes.
• Contribute to education in microelectronics, including teaching and supervision of MSc and PhD students.
• Strengthen the university's position in the European semiconductor ecosystem.

Requirements

• PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Applied Physics, or a related field.
• Strong international research track record with high-impact publications or patents.
• Recognized expertise in advanced packaging or heterogeneous integration.
• Proven ability to acquire competitive research funding and supervise PhD/postdoctoral researchers.
• Demonstrated ability to collaborate with industry partners.
• Must be willing to relocate to the Netherlands if not already based there.

Nice to have

• Experience in chiplet-based systems, AI hardware integration, or co-packaged optics.
• Strong track record in technology transfer.
• Vision for future directions in semiconductor system integration.

Culture & Benefits

• Academic Career Track with opportunities for professional development in research, education, and leadership.
• Customizable compensation package and discounts on health insurance.
• Flexible work schedules with options for hybrid work.
• Support for international employees via the Coming to Delft Service, including relocation and dual-career assistance.
• Access to excellent labs and an international community of professionals.

Hiring process

• Submission of CV, motivational letter, research statement, and teaching vision.
• Risk assessment regarding knowledge security as part of the final selection process.
• Obligatory exemption application from the Ministry of Education, Culture and Science (OCW) for specific research areas.