Staff Chemical Mechanical Planarization Engineer (Semiconductor)

TL;DR

Staff Chemical Mechanical Planarization (CMP) Engineer (Semiconductor): Leading CMP process development and technical strategy for advanced logic technologies with an accent on cross-node standardization and high-volume manufacturing readiness. Focus on resolving complex yield issues, driving process optimization, and collaborating across functional teams to ensure successful technology transfer.

Location: Must be based in or able to work on-site in Hillsboro, Oregon

Salary: $133,800–$255,200 USD

Company

A global leader in semiconductor manufacturing and technology innovation, driving advancements in silicon process and packaging for the AI era.

What you will do

• Lead CMP process development from concept through high-volume manufacturing implementation.
• Drive cross-node standardization and best practices to maximize efficiency and yield.
• Resolve complex CMP-related manufacturing and yield issues using data-driven methodologies.
• Bridge technology development and manufacturing teams to ensure smooth process transitions.
• Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions.
• Mentor junior engineers and provide technical leadership across the organization.

Requirements

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related field.
• 5+ years of experience in semiconductor manufacturing or process development.
• 3+ years of direct experience in CMP process development with hands-on tuning and characterization.
• Experience with major CMP equipment platforms (e.g., AMAT, Ebara).
• Experience with CMP consumables such as slurries, pads, and conditioning disks.
• Previous semiconductor foundry experience.

Nice to have

• Doctorate in a relevant technical field.
• Experience with advanced technology nodes (sub-10nm) and Gate All Around (GAA) architectures.
• Experience with CMP integration across other process modules like deposition, lithography, and etch.
• Background in CMP-relevant metrology and process control.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Hybrid work model allowing for a mix of on-site and off-site work.
• Opportunity to influence next-generation semiconductor technologies at a global scale.