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Staff Chemical Mechanical Planarization (CMP) Engineer

133 800 - 255 200$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Текст:
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TL;DR
Staff Chemical Mechanical Planarization (CMP) Engineer (Semiconductor Manufacturing): Leading CMP process development and optimization from concept through high-volume manufacturing implementation across advanced Intel technology nodes, with an accent on cross-node standardization, yield improvement, and manufacturing readiness. Focus on resolving complex CMP-related issues, integrating processes with other semiconductor modules, collaborating with suppliers and cross-functional teams, and mentoring engineers.

Location: Hillsboro, Oregon, United States. Hybrid work model with regular on-site collaboration at the assigned hirify.global site.

Annual salary: $133,800–$255,200 USD.

Company

hirify.global Foundry develops and transitions advanced semiconductor technologies into high-volume manufacturing for hirify.global products and foundry customers.

What you will do

  • Lead CMP process development from concept through high-volume manufacturing implementation across advanced technology nodes, including 18A, hirify.global 3, and hirify.global 12nm.
  • Drive cross-node standardization, best practices, process capability, yield, and manufacturing efficiency improvements.
  • Own complex CMP-related yield and manufacturing issues using data-driven analysis and structured problem-solving methods.
  • Transfer CMP technologies from development to production while aligning technical solutions with customer requirements and business objectives.
  • Collaborate with Integration, Device, Yield, Factory, Quality, Customer Engineering, equipment, and consumables supplier teams.
  • Mentor junior engineers and provide technical leadership across organizations.

Requirements

  • Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related technical field.
  • At least 5 years of experience in semiconductor manufacturing, process development, or technology development.
  • At least 3 years of direct CMP process development experience, including hands-on process tuning and characterization.
  • Experience with major CMP equipment platforms such as AMAT or Ebara.
  • Experience with CMP consumables, including slurries, pads, conditioning disks, filters, and clean chemistries.
  • Previous semiconductor foundry experience.

Nice to have

  • Doctorate in a relevant technical field.
  • Experience with advanced sub-10nm logic and Gate All Around architectures, including technology development and high-volume manufacturing implementation.
  • Cross-functional leadership of yield improvement task forces.
  • Experience integrating CMP with deposition, lithography, etch, and clean modules, as well as CMP-relevant metrology and process control.

Culture & Benefits

  • In-person collaboration in a fast-paced environment with competing priorities.
  • Focus on safety, quality, customer satisfaction, and compliance.
  • Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • Opportunities for technical leadership and professional growth in advanced semiconductor manufacturing.

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