Electromechanical Packaging Engineer (Microelectronics)

TL;DR

Electromechanical Packaging Engineer (Microelectronics): Supporting chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product lines with an accent on mechanical drawing creation and vendor collaboration. Focus on ensuring design for manufacturability (DFM) and integrating electrical design requirements into substrate layout.

Location: Must be based in or able to commute to Torrance, CA (Hybrid: minimum 3 days per week in office)

Salary: $150,000 – $200,000

Company

hirify.global is an incubation firm building and investing in rapidly scalable technology-led companies focused on healthcare, cyber, and national security.

What you will do

• Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product lines.
• Collaborate with substrate layout, ASIC design, and manufacturing engineering teams.
• Create mechanical drawings for substrate fabrication and packaged part assembly.
• Work directly with vendors for components, assembly, and testing.
• Apply design for manufacturability (DFM) principles to ensure high-quality production.

Requirements

• Minimum BS in Mechanical or Electrical Engineering required.
• 5+ years of experience in microelectronics packaging or PCB design.
• Proficiency with 3D mechanical CAD software (Creo, NX, Catia) and GD&T.
• Ability to read and create electrical schematics.
• Knowledge of foundry processes and chip scale assembly.
• Must be able to work in the office in Torrance, CA at least 3 days per week.

Nice to have

• Familiarity with PCB design tools such as Altium, Cadence, or Mentor.
• Basic understanding of component-level thermal analysis.
• MS or higher-level degree.

Culture & Benefits

• 100% employer-paid comprehensive health care (medical, dental, vision) for you and your family.
• 14 weeks of paid maternity and paternity leave.
• Unlimited PTO with management approval.
• Optional 401K, FSA, and equity incentives.
• Opportunities for professional development and continued learning.