CDAT Assembly Module Engineer (Semiconductor)

TL;DR

CDAT Assembly Module Engineer (Semiconductor): Managing high-volume manufacturing equipment and processes for integrated circuit production with an accent on process optimization and device miniaturization. Focus on improving production efficiencies, executing equipment maintenance, and transferring technology across global manufacturing sites.

Location: On-site presence required in Chengdu, PRC

Company

hirify.global Foundry focuses on state-of-the-art semiconductor manufacturing and packaging technology to enable cutting-edge silicon for the AI era.

What you will do

• Manage high-volume manufacturing equipment and processes for integrated circuit mass production.
• Perform tests and measurements to control critical dimensions and reduce process line defectivity.
• Implement equipment modifications to optimize production output, safety, quality, and cost.
• Execute maintenance and repair activities for equipment and module components.
• Drive continuous improvement of KPIs including yield, productivity, and defects.
• Lead equipment installation, conversion, and qualification during factory ramps.

Requirements

• Bachelor's degree in Mechanical, Chemical, Electrical Engineering, Sciences, or a related field.
• Proficiency in problem-solving using tools such as MBPS, PCS, or JMP.
• Must be based in or able to work on-site in Chengdu, PRC.

Nice to have

• Master's degree in a relevant field.
• Experience in AI.
• Experience in equipment design, sustaining, and process development.

Culture & Benefits

• Opportunity to work within a worldwide factory network developing compute devices.
• Engagement with cutting-edge silicon process and packaging technology leadership.
• Commitment to ethical hiring practices and Responsible Business Alliance (RBA) compliance.