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2 дня назад

Module Development Defect Inspection Engineer (Semiconductor)

115 110 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Module Development Defect Inspection Engineer (Semiconductor): Driving technology development and enabling high-volume manufacturing for semiconductor processes with an accent on process integration, equipment solutions, and defect inspection. Focus on performing path-finding activities, optimizing manufacturing parameters, and partnering with suppliers to enable innovative device architectures.

Location: Must be based in Hillsboro, Oregon (Onsite)

Salary: $115,110–$219,550 USD

Company

hirify.global is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

  • Drive technology development and enable high-volume manufacturing through process integration and equipment solutions.
  • Lead the design and development of sophisticated manufacturing processes, including material selection and parameter optimization.
  • Perform path-finding activities to support hardware development and innovative device architectures.
  • Recommend and implement modifications to operating equipment to improve production efficiency and output.
  • Partner with key equipment and materials suppliers to develop enabling technology elements.
  • Conduct process technology feasibility studies using theoretical simulations and practical engineering methods.

Requirements

  • Bachelor's degree in STEM with 5+ years of experience, Master's with 4+ years, or PhD.
  • Must be able to work onsite in Hillsboro, Oregon.
  • Technical expertise in semiconductor processing, wafer-level assembly, or cleanroom environments.
  • Proficiency in process development methodologies and statistical process control.
  • Strong collaboration skills for working with cross-functional teams.

Nice to have

  • Strong fundamental understanding of metrology and development experience.
  • Experience with packaging processes or equipment automation development.
  • Demonstrated expertise in leveraging data analysis tools for process optimization.
  • Project management experience.

Culture & Benefits

  • Competitive total compensation package including pay and stock bonuses.
  • Comprehensive health, retirement, and vacation benefit programs.
  • Opportunity to work on industry-leading semiconductor technology.
  • Collaborative environment focused on innovation and continuous improvement.

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