Module Development Engineer - CMP

TL;DR

Module Development Engineer - CMP (Semiconductor/CMP): Developing and sustaining planarization techniques for semiconductor materials and architectures with an accent on process integration, equipment solutions, and feasibility studies. Focus on designing and optimizing technically sophisticated manufacturing processes, performing pathfinding with simulations/engineering methods, and partnering with equipment and materials suppliers to enable future technology roadmaps.

Company

hirify.global develops semiconductor and computing technologies for next-generation platforms.

What you will do

• Drive CMP technology development and enablement for high-volume manufacturing and future technologies, including process integration, equipment solutions, and feasibility studies.
• Lead design and development of manufacturing processes and repair reverse engineering, covering material selection, parameter optimization, equipment metrology, and system design.
• Perform pathfinding for process and hardware development to support innovative device architectures and develop technology roadmaps.
• Recommend and implement equipment operating modifications to improve production efficiency, manufacturing techniques, and output for existing products.
• Partner with equipment and materials suppliers to develop and implement enabling technology elements.
• Conduct process feasibility studies using theoretical simulations and practical engineering methods, staying current on industrial trends.

Requirements

• On-site presence required at the assigned hirify.global site (hybrid model splits time between on-site and off-site).
• Bachelor’s degree in a relevant STEM field (Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or related) plus 5+ years of semiconductor industry experience in semiconductor processing/fabrication.
• OR Master’s degree in a relevant STEM field plus 4+ years of semiconductor industry experience in semiconductor processing/fabrication.
• OR PhD degree in a relevant STEM field plus 1+ years of semiconductor industry experience in semiconductor processing/fabrication.

Culture & Benefits

• Hybrid work model: split time between on-site at the assigned hirify.global site and off-site.
• Total compensation includes competitive pay, stock bonuses, and benefits such as health, retirement, and vacation.
• Annual salary range for US-located roles: $133,800.00–$255,200.00 USD.

Hiring process

• Initial consideration based on minimum qualifications; recruiter shares location-specific compensation details during the hiring process.
• Interviews and evaluation of technical fit for CMP process development responsibilities.