Intern Electronic Packaging & Process Engineering

TL;DR

Intern Electronic Packaging & Process Engineering (Engineering): Developing and optimizing production processes for environmental and flow sensors with an accent on encapsulation and testing. Focus on commissioning and optimizing highly automated systems, performing precise measurements, and conducting data analysis.

Location: Must be based in Stäfa, Switzerland (Hybrid role)

Company

hirify.global is a leading global developer and manufacturer of environmental and flow sensors for automotive, industrial, medical, and consumer electronics applications.

What you will do

• Develop and optimize production processes for sensor encapsulation and testing.
• Participate in the commissioning, approval, and optimization of highly automated manufacturing systems.
• Perform precise technical measurements and conduct data analysis.
• Collaborate with a dynamic R&D team on cutting-edge equipment.
• Translate technical ideas into practical solutions.

Requirements

• BSc or MSc degree in an engineering discipline (e.g., mechanical engineering, materials science).
• Basic proficiency in Python and data analysis.
• Strong German and English language skills.
• Hands-on mindset and creative problem-solving abilities.

Culture & Benefits

• Valuable professional experience in a leading R&D environment.
• Flexible working arrangements with options for home office.
• Generous season ticket discounts for public transport.
• Above-statutory contributions to the pension scheme.
• Regular social events, sports activities, and monthly intern meet-ups.