LTD Process Development Integration Engineer (Semiconductor)

TL;DR

LTD Process Development Integration Engineer (Semiconductor): Driving the development and optimization of advanced semiconductor manufacturing processes with an accent on yield improvement, statistical process control, and root cause analysis. Focus on managing quality events, reducing process variation, and ensuring high-volume manufacturing readiness for cutting-edge silicon technologies.

Location: Must be based on-site in Hillsboro, Oregon

Salary: $99,030–$139,810 USD

Company

hirify.global is a global leader in semiconductor manufacturing, driving innovation in computing technology and silicon process development.

What you will do

• Lead Quality Event Form (QEF) responses and coordinate Material Review Board (XRB) actions.
• Perform fab and E-test parameter trending using statistical analysis (ANOVA) to identify process issues.
• Conduct data-driven root cause analyses for fab quality events and implement preventative solutions.
• Monitor Yield Cliffs and Product Performance Indicators to ensure manufacturing quality.
• Drive process variation reduction through deep understanding of semiconductor physics and applied statistics.
• Develop and implement process targeting strategies to optimize product performance and yield.

Requirements

• Bachelor’s degree in Electrical Engineering, Physics, Material Science, or related STEM field.
• 1+ years of prior semiconductor industry experience.
• 6+ months of experience with statistical data analysis tools (JMP, Excel, or MATLAB).
• 6+ months of experience with root cause analysis and CAPA during quality events.
• Must be available for a compressed work week (CWW) shift: Thursday–Saturday and every other Wednesday, 7 am – 7 pm.
• Not eligible for hirify.global immigration sponsorship.

Culture & Benefits

• Competitive total compensation package including pay and stock bonuses.
• Comprehensive health, retirement, and vacation benefit programs.
• Opportunity to work on world-class silicon process and packaging technology.
• Collaborative environment focused on advancing Moore's Law and global manufacturing scale.