Package Assembly Integration Engineer (Semiconductor)

TL;DR

Package Assembly Integration Engineer (Semiconductor): Driving systems development and tactical execution for EMIB-T factories with an accent on integrated process solutions, safety, and quality. Focus on conducting FMEA studies, optimizing equipment for high-volume manufacturing, and leveraging big data analysis for process design improvement.

Location: Onsite in Phoenix, Arizona, US

Salary: $155,520 – $255,200 USD

Company

hirify.global Foundry delivers cutting-edge silicon process and packaging technology to enable leadership products for the AI era.

What you will do

• Drive systems development and business processes for EMIB-T factories.
• Conduct feasibility and FMEA studies to ensure safety, quality, and reliability.
• Select and develop materials and equipment for high-volume manufacturing.
• Design and execute experiments to characterize processes and improve performance.
• Resolve customer requests by partnering with product and module engineering teams.
• Utilize big data analysis to identify and correct process design weaknesses.

Requirements

• Bachelors in STEM with 5+ years of industry experience, or Masters with 3+ years.
• Experience in EMIB package assembly, substrate design, or manufacturing.
• Strong analytical and problem-solving skills.
• Effective written and verbal communication skills.
• Ability to manage multiple projects and detailed build plans.

Nice to have

• Extensive knowledge of package assembly and process flows.
• Previous experience in a semiconductor foundry.

Culture & Benefits

• Competitive pay and stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Opportunity to work within a worldwide factory network using state-of-the-art technology.