Tape Out Engineer (Semiconductors)

TL;DR

Tape Out Engineer (Semiconductors): Ensuring physical and logical design data meet manufacturing requirements and quality standards before fabrication with an accent on design integrity and foundry compliance. Focus on coordinating the tape out process, verifying databases, and resolving technical issues with cross-functional teams.

Location: Hsinchu, Taiwan (Onsite)

Company

hirify.global is a leading semiconductor manufacturer specializing in secure connectivity solutions for embedded applications.

What you will do

• Coordinate and execute the tape out process to ensure timely delivery of design data to manufacturing.
• Verify design integrity by reviewing databases and documentation to address discrepancies or errors.
• Collaborate with design, technologists, and process engineering teams to optimize designs for manufacturability.
• Ensure all final deliverables strictly conform to foundry requirements.
• Maintain detailed records of tape out procedures and revisions for future process improvement.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field (Master’s preferred).
• Experience with physical design tools such as Cadence and Synopsys.
• Knowledge of semiconductor manufacturing workflows.
• Ability to work flexible hours to support critical tape-out milestones.
• English: B2 proficiency required for effective collaboration across technical teams.