Process Integration Development Engineer (Semiconductors)

TL;DR

Process Integration Development Engineer (Semiconductors): Characterizing semiconductor nano-devices using advanced transmission electron microscopy (TEM) with an accent on expanding analytical capabilities and imaging analysis. Focus on performing strain, 4D STEM, EELS, and EDX analysis to optimize manufacturing processes and troubleshoot process flow issues.

Location: On-site in Hillsboro, Oregon, US

Salary: $115,110 – $219,550 USD

Company

hirify.global is a global leader in semiconductor manufacturing, developing cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Characterize semiconductor nano-devices using advanced TEM to expand analytical capabilities.
• Perform specialized imaging analysis including strain, 4D STEM, EELS, and EDX.
• Collaborate with engineering teams to optimize metrology strategies and troubleshoot process flow issues.
• Conduct detailed technical procedures for sample preparation and imaging using FIB and TEM tools.
• Contribute to continuous improvement efforts within high-volume manufacturing environments.

Requirements

• PhD degree in Materials Science, Chemistry, Physics, or a related technical field.
• Hands-on experience with Transmission Electron Microscopy (TEM) operation.
• Must be based in or able to work on-site in Hillsboro, Oregon.

Nice to have

• Experience with Python scripting, MATLAB, or other programming languages.
• Hands-on experience with TEM sample imaging automation.
• Experience with advanced TEM techniques such as EELS, EDX, and/or 4D STEM.
• Knowledge of semiconductor process integration.

Culture & Benefits

• Total compensation package including competitive pay and stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Opportunity to work at the forefront of world-changing technology in the Foundry labs.