Senior Equipment Engineer (Trim & Form)

TL;DR

Senior Equipment Engineer (Trim & Form) (semiconductor manufacturing): Lead equipment reliability, performance, and continuous improvement for trim and form operations across high-volume semiconductor packaging, with an accent on downtime mitigation using MTBF/MTBA analysis and ramp-up readiness for new product introductions. Focus on diagnosing equipment/tooling/process defects impacting yield and quality, and driving documentation, technician coverage for 24/7 operations, and continuous improvement initiatives such as MVA, yield enhancement, and UPH optimization.

Location: Seremban

Company

hirify.global is a semiconductor manufacturer focused on delivering reliable manufacturing and advanced packaging technologies.

What you will do

• Lead maintenance, optimization, and continuous improvement of trim and form equipment across multiple semiconductor package types.
• Monitor equipment downtime (DT) and develop mitigation strategies using MTBF/MTBA analysis; verify and manage scheduled downtime effectiveness.
• Partner with Process Engineering for new product development and qualification to ensure trim and form equipment readiness for high-volume manufacturing (HVM).
• Develop and maintain technical documentation (control plans, process specifications, SOPs, FMEAs, and technical reports) and support technology/process/equipment transfers.
• Plan technician headcount coverage for 24/7 operations, delegate tasks, and mentor technicians with KPI setting and performance evaluations.
• Diagnose and resolve trim and form equipment/tooling/process defects affecting yield and product quality; drive continuous improvement (MVA, yield enhancement, UPH optimization) and manage spare parts and supplier coordination.

Requirements

• Bachelor’s degree in engineering or a related technical discipline.
• Minimum 5 years of experience in the semiconductor industry, including at least 3 years specializing in trim and form equipment and tooling.
• Strong hands-on experience with trim and form machines used in semiconductor packaging.
• Solid understanding of tooling design, material properties and behavior, GD&T, tolerances, and metrology equipment (added advantage).
• Proficiency in statistical analysis tools such as JMP and Minitab, plus strong technical documentation skills.
• Proven leadership capability guiding technicians in a 24/7 manufacturing environment and strong analytical/problem-solving and cross-functional communication skills.

Culture & Benefits

• Equal-opportunity employer committed to diversity and inclusion.
• Inclusive and accessible recruitment process with reasonable adjustments available.
• Opportunity to join employee resource groups (e.g., Pride Network Group and women’s groups).
• Commitment to increasing women in management positions to 30% by 2030.