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5 дней назад

Package Competence Engineer (Semiconductors)

Формат работы
onsite
Тип работы
fulltime
Грейд
middle/senior
Английский
b2
Страна
UK
Релокация
UK
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Package Competence Engineer (Semiconductors): Leading the assembly, reliability, and design of Power MOSFET packaging with an accent on technical expertise and cross-functional project management. Focus on developing advanced packaging strategies, generating design rules, and collaborating with global assembly sites to enhance device performance.

Location: Must be based in Manchester, UK (Relocation support and visa sponsorship available).

Company

hirify.global is a global semiconductor manufacturer producing over 100 billion devices annually with a commitment to sustainability and diversity.

What you will do

  • Lead cross-functional teams in package-related development projects.
  • Formulate and execute packaging strategy and technical roadmaps.
  • Develop strong links with assembly site engineers to support business objectives.
  • Provide expert support to product lines regarding packaging concerns.
  • Generate new design rules, concepts, and patentable ideas.

Requirements

  • Degree in Engineering, Physics, or a relevant discipline.
  • Extensive knowledge of power semiconductor device packages, materials, and assembly processes.
  • Expert grasp of physical and chemical properties of materials used in packaging.
  • Familiarity with reliability tests, failure modes, Design of Experiments, and AutoCAD.
  • Must be based in or willing to relocate to Manchester, UK.

Nice to have

  • Experience planning and controlling complex high-profile projects.
  • Established network with suppliers and subcontractor assembly partners.

Culture & Benefits

  • 33 days annual leave plus enhanced parental leave and sick pay.
  • Excellent contributory pension scheme up to 9% and bonus up to 6%.
  • Funded academic support up to PhD level and clear career development pathways.
  • On-site medical centre and subsidised canteen.
  • Commitment to diversity through various employee resource groups and inclusive hiring practices.

Hiring process

  • Recruiter review.
  • 30-minute technical interview.
  • 60-minute competency interview.

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