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15 часов назад

High Speed PCB Layout Designer (RF / Optics)

95 700 - 127 600$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle/senior
Английский
b2
Страна
Canada
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

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Описание вакансии

Текст:
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TL;DR

High Speed PCB Layout Designer (RF / Optics): Designing complex multilayer PCB layouts for high-speed optical components and AI datacenter systems with an accent on RF front-end circuits, SERDES interfaces, and tight impedance control. Focus on collaborating with SI/PI and mechanical teams to ensure signal integrity, thermal performance, and manufacturability of dense modules.

Location: Onsite in Ottawa, Canada

Salary: $95,700–$127,600 CAD per annum

Company

hirify.global is a global leader in semiconductor solutions, providing essential infrastructure for cloud, AI, and enterprise architectures.

What you will do

  • Design complex multilayer PCB layouts for RF front-end circuits and high-speed SERDES interfaces.
  • Collaborate with hardware, SI/PI, and mechanical teams to meet thermal and mechanical constraints.
  • Ensure compliance with signal integrity and EMI/EMC requirements.
  • Support stack-up definition and material selection for high-frequency performance.
  • Work with vendors on DFM and DFA to ensure manufacturability.
  • Generate and release fabrication deliverables including Gerbers and assembly documentation.

Requirements

  • Bachelor’s degree in electrical engineering or a related field.
  • 3-5 years of experience in PCB layout, specifically with RF circuits at GHz frequencies.
  • Deep understanding of controlled impedance, differential pair routing, and grounding strategies.
  • Proficiency in Cadence Allegro or Altium Designer.
  • Experience with multilayer stack-up design (10+ layers).
  • Must be eligible to access export-controlled information under U.S. export control laws.

Nice to have

  • Knowledge of high-frequency PCB materials and thermal management.
  • Experience with High-Density Interconnect (HDI) designs.
  • Familiarity with co-design environments and scripting for workflow automation.

Culture & Benefits

  • Competitive compensation and comprehensive benefits package.
  • Collaborative, transparent, and inclusive work environment.
  • Opportunities for professional growth and development in a fast-paced industry.
  • Access to resources for building transformative technology.

Hiring process

  • Interviews evaluate individual experience and communication skills in real time.
  • AI tools are strictly prohibited during interviews and will result in disqualification.

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