Senior Thin Films Engineer

TL;DR

Senior Thin Films Engineer (Thin Film Deposition): Drive process innovation for thin film deposition in volume manufacturing, ensuring manufacturability and seamless transitions from early development to high-volume production with an accent on CVD, ALD, PVD, epitaxy, and thermal/plasma deposition. Focus on defectivity reduction, uniformity improvements, and end-to-end resolution of manufacturing challenges to meet aggressive technology node targets.

Location: US, Oregon, Hillsboro (Primary) and US, Arizona, Phoenix (Additional)

Salary: $133,800.00–$255,200.00 USD (annual, US locations)

Company

hirify.global Foundry Technology Manufacturing (FTM) builds and scales advanced semiconductor manufacturing for foundry customers.

What you will do

• Lead thin film process excellence across CVD, ALD, PVD, epitaxy, and thermal/plasma deposition, including furnace, implant, anneal, and/or treatment technologies.
• Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
• Reduce defectivity and improve uniformity through systematic process enhancement and data-driven problem solving.
• Optimize equipment performance with internal teams and key suppliers.
• Align technical vision with customer requirements and business objectives; synthesize complex technical data into strategic responses.
• Collaborate cross-functionally across Technology Development, High Volume Manufacturing, and business groups; present findings to diverse audiences.

Requirements

• Master’s degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or a STEM-related field.
• 5+ years of semiconductor industry experience with strong focus on thin film deposition processes.
• Proven experience in process development, technical leadership, and manufacturing engineering.
• Extensive experience working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization.
• Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions.
• Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.

Nice to have

• Doctoral degree with research publications and a patent portfolio in thin film technologies.
• Expertise in Gate All Around (GAA) logic technologies in semiconductor foundry environments.
• Semiconductor foundry experience and track record delivering customized solutions across Technology Development and HVM.

Culture & Benefits

• Hybrid work model: split time between on-site work at the assigned hirify.global site and off-site work.
• Total compensation package including competitive pay, stock bonuses, and benefits (health, retirement, vacation).
• Opportunity to work on advanced semiconductor manufacturing technology nodes and customer requirements.

Hiring process

• Recruiter discussion to align on location-specific compensation within the posted US range.
• Interview process evaluating technical leadership, process innovation experience, and cross-functional collaboration.