OTF Failure Analysis Technician (Semiconductors)

TL;DR

OTF Failure Analysis Technician (Semiconductors): Operate failure analysis and sample preparation equipment to support high-volume semiconductor manufacturing, with an accent on Dual Beam FIB/PFIB cross-sectioning, TEM lamella preparation, and SEM imaging. Focus on executing moderately complex fabrication procedures from schematics and maintaining lab safety while working a permanent night shift on-site in Phoenix.

Company

hirify.global develops semiconductor and foundry technologies for advanced computing and AI-era products.

What you will do

• Operate lab instruments to support advanced technology node manufacturing, including handling silicon wafer pieces.
• Run sputter and spin coaters for sample pre-treatment.
• Operate Dual Beam FIB/PFIB to perform site-specific cross-sectioning and prepare TEM samples (marking, protective material deposition, de-layering, imaging, and lamella preparation).
• Use SEM for imaging and material analysis.
• Perform sample fabrication procedures using schematics, diagrams, and written/verbal instructions.
• Participate in safety forums, lab sustaining/development, process transfer, tool ownership, BKM development, and cross-training.

Requirements

• On-site role in Phoenix, Arizona (US).
• High school diploma OR advanced engineering studies in electrical/electronic or related field.
• 2+ years of experience in the semiconductor industry, or experience with failure analysis tools.
• Ability to work a permanent night shift and compressed 12-hour shifts.
• Ability to lift and carry up to 50 lb; long time standing and occasional walking.
• Verbal and written communication skills; ability to work independently and in a team.

Culture & Benefits

• On-site work model with permanent night shift scheduling.
• Total compensation includes competitive pay, stock bonuses, and benefits (health, retirement, vacation).
• Annual salary range for US locations: $60,450.00–99,770.00 USD (hourly role).
• Opportunity to contribute to lab sustaining, development, and cross-training.

Hiring process

• Application review based on minimum qualifications; recruiter shares location-specific compensation details during the hiring process.
• Interviews include evaluation of fit for lab work, safety, and failure analysis experience.