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System IC Architect - Advanced Power Systems (AI Compute Power)

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
France/US/Europe
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
System IC Architect - Advanced Power Systems (AI Compute Power): Defining and launching next-generation Point-of-Load power semiconductor modules and System-in-Package solutions for automotive and AI compute platforms with an accent on system-level architecture, power conversion, packaging, and thermal optimization. Focus on integrating ICs and power semiconductors, solving electrical and thermal performance challenges, and developing reliable high-performance compute power systems.

Location: 100% remote from anywhere in the United States, with required quarterly travel to the Chandler site; also open to EMEA locations, especially France.

Company

hirify.global develops semiconductor solutions for automotive, industrial, and high-performance computing applications.

What you will do

  • Define system IC architecture, product concepts, and specifications for Point-of-Load power semiconductor modules and System-in-Package solutions.
  • Develop product and technology roadmaps with product line leaders and R&D teams.
  • Translate customer requirements into advanced power management, packaging, and thermal management solutions.
  • Lead integration of ICs and power semiconductors into advanced packages for AI compute, automotive 48V systems, and electrification platforms.
  • Collaborate with system, modeling, design, packaging, and manufacturing engineering teams to validate high-performance compute power designs.
  • Support customer co-development and design-in activities, provide technical guidance, and report KPIs and project status to executive stakeholders.

Requirements

  • Master’s degree in Power Electronics, Electrical Engineering, or a related field; a Ph.D. is preferred.
  • 15+ years of experience in power semiconductors, packaging, and system-level integration.
  • Expertise in System-in-Package integration, thermal management, electrical performance, and advanced reliability.
  • Experience powering high-performance compute SoC platforms; automotive-grade standards and power management experience are highly valued.
  • Proficiency with circuit simulation tools such as Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, or Verilog-AMS, plus knowledge of PCB materials and stack-up.
  • Ability to lead cross-functional global teams, manage complex projects, communicate with customers, and travel globally.

Nice to have

  • Experience with ISO 26262 and/or IEC 61508 functional safety standards.
  • Ph.D. in Power Electronics, Electrical Engineering, or a related field.
  • Automotive power management experience.

Culture & Benefits

  • Full-time position within the Advanced Power Systems department.
  • Remote work is available from the United States, with quarterly visits to the Chandler site.
  • Locations in EMEA, especially France, are also considered.
  • Customer visits and global travel are part of the role.

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