Equipment Engineer (Semiconductors)

TL;DR

Equipment Engineer (Semiconductors): Designing wire bond related parts and tools and optimizing machine maintenance with an accent on equipment reliability and efficiency. Focus on overhauling wire bond machines, standardizing repair procedures, and managing spare parts lifecycles.

Location: Kaohsiung, Taiwan

Company

World leader in secure connectivity solutions for embedded applications, serving automotive, industrial, and IoT markets.

What you will do

• Design wire bond related parts and tools.
• Rationalize and optimize machine preventive maintenance frequency.
• Evaluate new wire bond machinery in cooperation with process engineers.
• Train line repair technicians and standardize machine repair procedures.
• Manage spare parts lifetime evaluation and safety stock.
• Overhaul wire bond machines and collaborate with IT on production systems.

Requirements

• Background in Mechanical Engineering (ME) or Electrical Engineering (EE).
• Ability to overhaul wire bond machines.
• Capability to design tools and parts for wire bonding.

Culture & Benefits

• Professional growth through online and offline learning opportunities.
• Inclusive work environment with a strong commitment to diversity, equality, and sustainability.
• Strict policy against racism, discrimination, and harassment.