Fullchip Floorplan Design Engineer (ASIC)

TL;DR

Fullchip Floorplan Design Engineer (ASIC): Designing top-down SoC floorplans and optimizing IP placement for latency and area with an accent on power grid creation, multi-power domain planning, and die-area estimation. Focus on driving physical convergence, managing metal stacks, and implementing industry-standard EDA flows for high-performance silicon products.

Location: Hybrid (USA: Fort Collins, Beaver Brook, Hillsboro, Folsom, Austin)

Salary: $105,650 - $200,340

Company

hirify.global is a global leader in designing and manufacturing silicon products that power data centers, AI-accelerated systems, and connected devices.

What you will do

• Execute top-down SoC floorplanning, including IP placement, partitioning, and PG grid creation.
• Define optimal physical dimensions and estimate die-area based on technology selection and product costs.
• Supervise physical placement and channel planning for sub-systems to ensure area and schedule convergence.
• Collaborate with clock and power delivery teams to optimize metal allocation and block-level floorplans for APR.
• Develop and refine methodologies and tools to streamline the physical design workflow.

Requirements

• Bachelor's in Electrical/Electronics/Computer Engineering (3+ years exp) or Master's (2+ years exp).
• 2+ years of experience with industry-standard EDA tools for floorplanning and APR.
• Experience with multi-power domain designs and Synopsys Fusion Compiler.
• Proficiency in TCL, Python, or Perl programming.
• Experience with Calibre or ICV verification.
• Must be based in the US to support the hybrid work model.

Nice to have

• Deep knowledge of SoC requirements including voltage/clock domains, thermal management, and Die-to-Die interconnects.
• Expertise in ICC2/FC, Place and Route flows, and Physical Design Verification.
• Experience with large subsystem designs (20M+ gates) at frequencies exceeding 2GHz.
• Understanding of UPF/CPF and low power static verification.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Hybrid work model allowing a split between on-site and off-site work.