Tape Out Engineer (Semiconductors)

TL;DR

Tape Out Engineer (Semiconductors): Managing the final checkpoint of integrated circuit designs before fabrication with an accent on design integrity and manufacturing requirements. Focus on resolving technical discrepancies, optimizing designs for manufacturability, and coordinating delivery to foundries.

Location: Hsinchu, Taiwan

Company

A global leader in secure connectivity solutions for embedded applications serving automotive, industrial, IoT, and communication infrastructure markets.

What you will do

• Coordinate and execute the tape out process to ensure timely and accurate delivery of design data to manufacturing.
• Verify design integrity by reviewing databases and documentation to address discrepancies or errors.
• Collaborate with cross-functional teams, including design, technologists, and process engineering, to optimize designs.
• Ensure all deliverables conform strictly to foundry requirements.
• Maintain detailed records of tape out procedures and revisions for future process improvement.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field (Master’s preferred).
• Experience with physical design tools such as Cadence and Synopsys.
• Knowledge of semiconductor manufacturing workflows.
• Ability to work under tight deadlines and willingness to maintain flexible working hours.
• English: Effective communication skills required

Culture & Benefits

• Access to online and offline learning opportunities for professional skill development.
• Commitment to sustainability with measurable year-on-year progress.
• Inclusive work environment focusing on diversity, inclusion, and equality.