Principal Process Development Engineer (Semiconductor)

TL;DR

Principal Process Development Engineer (Semiconductor): Developing and optimizing semiconductor assembly processes for new products and platforms with an accent on wire bond and FOL process stability. Focus on driving end-to-end process development using Six Sigma, DOE, and statistical analysis to ensure high-yield manufacturing.

Location: Seremban, Malaysia

Company

hirify.global is a global semiconductor manufacturer specializing in essential components for various electronic applications.

What you will do

• Develop and characterize new semiconductor process technologies using DOE, SPC, and FMEA.
• Drive end-to-end process development from initial concept to stable, high-yield manufacturing solutions.
• Provide technical input for assembly processes and equipment solutions for new products and platforms.
• Lead technical discussions and troubleshooting for wire bond and related FOL processes across project teams.
• Conduct benchmarking and technology studies to support the package roadmap and continuous improvement.
• Utilize statistical analysis tools like Minitab or Statistica to drive data-based engineering decisions.

Requirements

• Bachelor's degree in engineering or an equivalent related field.
• At least 5 years of experience in a semiconductor or manufacturing environment.
• Hands-on experience in FOL processes including wafer dicing, die bond, plasma, wire bond, and AOI.
• Strong knowledge of wire bond packaging technologies and Six Sigma methodologies (DOE, SPC, FMEA, 8D).
• Fluent English communication skills are required.
• Ability to work across functions and sites to resolve complex production issues.

Culture & Benefits

• Inclusive and diverse work environment with a strong commitment to equal opportunity.
• Access to employee resource groups such as the Pride Network and global/local Women's groups.
• Commitment to diversity in leadership, aiming for 30% women in management by 2030.
• Provision of a safe work environment with reasonable adjustments for accessibility.