Silicon Packaging Design Engineer (Semiconductors)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
TL;DR
Silicon Packaging Design Engineer (Semiconductors): Driving end-to-end development for silicon packaging substrate design from concept through tapeout with an accent on physical layout, routing, and cost-performance tradeoffs. Focus on optimizing silicon-package-board performance, defining substrate design rules, and implementing design-for-manufacturability (DFM) strategies.
Location: On-site presence required in Phoenix, AZ or Hillsboro, OR, USA
Salary: $141,910 - $200,340
Company
Foundry specializes in state-of-the-art semiconductor manufacturing and advanced packaging technology for the AI era.
What you will do
- Drive end-to-end substrate design development from initial concept through tapeout.
- Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs.
- Optimize silicon-package-board performance and pinout in collaboration with silicon and hardware teams.
- Define substrate design rules and resolve design rule checks (DRCs) to refine package designs.
- Implement design-for-manufacturability (DFM) strategies to enhance cost efficiency.
- Manage technical documentation and collaterals within the product lifecycle management system.
Requirements
- Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of experience (or Master's with 3+ years, or PhD).
- Experience with package/board design tools such as Siemens Xpedition, Cadence Allegro, Valor NPI, AutoCAD, or SolidWorks.
- Expertise in package design, interconnect methodologies, and manufacturability principles.
- Must be based in or able to work on-site in Phoenix, AZ or Hillsboro, OR.
Nice to have
- Familiarity with electrical modeling and simulation tools like PowerDC, HyperLynx, Q3D, or HFSS.
- Scripting experience using Python, VB, or C.
- Strong analytical skills for debugging and providing creative hardware solutions.
Culture & Benefits
- Competitive total compensation package including stock bonuses.
- Comprehensive health, retirement, and vacation programs.
- Opportunity to work within a worldwide factory network at the forefront of semiconductor technology.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →