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24 часа назад

Silicon Packaging Design Engineer (Semiconductors)

141 910 - 200 340$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Silicon Packaging Design Engineer (Semiconductors): Driving end-to-end development for silicon packaging substrate design from concept through tapeout with an accent on physical layout, routing, and cost-performance tradeoffs. Focus on optimizing silicon-package-board performance, defining substrate design rules, and implementing design-for-manufacturability (DFM) strategies.

Location: On-site presence required in Phoenix, AZ or Hillsboro, OR, USA

Salary: $141,910 - $200,340

Company

hirify.global Foundry specializes in state-of-the-art semiconductor manufacturing and advanced packaging technology for the AI era.

What you will do

  • Drive end-to-end substrate design development from initial concept through tapeout.
  • Perform substrate fit and routing studies to establish design, performance, and cost tradeoffs.
  • Optimize silicon-package-board performance and pinout in collaboration with silicon and hardware teams.
  • Define substrate design rules and resolve design rule checks (DRCs) to refine package designs.
  • Implement design-for-manufacturability (DFM) strategies to enhance cost efficiency.
  • Manage technical documentation and collaterals within the product lifecycle management system.

Requirements

  • Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of experience (or Master's with 3+ years, or PhD).
  • Experience with package/board design tools such as Siemens Xpedition, Cadence Allegro, Valor NPI, AutoCAD, or SolidWorks.
  • Expertise in package design, interconnect methodologies, and manufacturability principles.
  • Must be based in or able to work on-site in Phoenix, AZ or Hillsboro, OR.

Nice to have

  • Familiarity with electrical modeling and simulation tools like PowerDC, HyperLynx, Q3D, or HFSS.
  • Scripting experience using Python, VB, or C.
  • Strong analytical skills for debugging and providing creative hardware solutions.

Culture & Benefits

  • Competitive total compensation package including stock bonuses.
  • Comprehensive health, retirement, and vacation programs.
  • Opportunity to work within a worldwide factory network at the forefront of semiconductor technology.

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