Engineer (Mechanical Engineering)

TL;DR

Engineer (Mechanical Engineering): Developing and optimizing Thermopile products following NPI protocols with an accent on semiconductor packaging and process optimization. Focus on conducting failure analysis, supporting mass production transfers to Batam, and implementing Six Sigma methodologies to improve yield.

Location: Singapore (requires regular travel to Batam, Indonesia)

Company

hirify.global is a global leader in photonics and sensor technology solutions.

What you will do

• Support product development for Thermopile products through the complete NPI process.
• Carry out technical assessments to support technology development in Wiesbaden.
• Manage customer design-in activities to achieve project wins.
• Coordinate NPI transfers of products into the mass production site in Batam, Indonesia.
• Implement cost and productivity improvements through process optimization and material qualification.
• Conduct failure analysis and root cause evaluations to resolve customer complaints.

Requirements

• Bachelor’s Degree in Mechanical or Materials Engineering.
• 1–2 years of experience in Product Development, R&D, or Electronics Packaging (fresh graduates are welcome).
• Proficiency in statistical analysis tools such as Excel and Minitab.
• Knowledge of Six Sigma methodologies (SPC, DMAIC, DOE, FMEA).
• Familiarity with failure analysis methodologies.
• Willingness to travel regularly to the factory in Batam.

Nice to have

• Knowledge of CAD design tools.
• Knowledge of semiconductor packaging and assembly processes (Dicing, Die Bonding, Wire Bonding, Encapsulation).

Culture & Benefits

• Regular full-time employment.
• Opportunity to work within a global R&D framework across Singapore, Germany, and Indonesia.
• Direct involvement in the transition from prototype development to mass production.