R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization (Semiconductor)

TL;DR

R&D Engineer (Semiconductor Test): Developing device testing at wafer, die, and module levels for optoelectronic transceivers and mixed-signal ASICs with an accent on test hardware/software development and device characterization. Focus on designing test application PCBs, optimizing productive test packages, and evaluating characterization results to ensure cost-efficient solutions.

Location: Regensburg, Germany

Company

A global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

What you will do

• Define test requirements and methods for optoelectronic transceiver and sensor products as well as for mixed signal ASICs.
• Develop, bring up and debug test hardware and software for evaluation, device characterization and production testing.
• Design test application PCBs, test sockets, and probe cards.
• Perform full characterization of devices over corner conditions according to specification.
• Evaluate, analyze and report characterization and production test results.
• Collaborate with IC-designers and product-designers to optimize productive test packages for cost-efficiency.

Requirements

• Master’s Degree or PhD in Electrical Engineering, Physics or equivalent discipline with focus on semiconductor devices.
• 3+ years of experience in semiconductor testing.
• Proficiency in spoken and written English is required; readiness to learn German is expected.
• Must be based in or able to work from Regensburg, Germany.
• Ability to travel up to 20% of the time depending on project requirements.

Nice to have

• Expertise in discrete measurement equipment (oscilloscope, SMU, spectrum analyzer) and ATE equipment (Teradyne, Advantest, LTX).
• Knowledge of wafer probers and probe card technologies.
• Proficiency in Python, C++, LabVIEW, NI TestStand, C#, Java, or MATLAB.
• Experience using AI tools to support engineering tasks.