Packaging Module Development Engineer (Semiconductor)

TL;DR

Packaging Module Development Engineer (Semiconductor): Developing innovative material and design solutions for next-generation assembly and packaging with an accent on thermal material solutions and Integrated Heat Spreaders (IHS). Focus on defining material specifications, optimizing manufacturing design rules (DFP/DFM/DFC), and solving material-related root cause issues in high-volume manufacturing.

Location: Hybrid in Phoenix, Arizona, US

Salary: $99,030.00 - $188,890.00

Company

hirify.global Foundry specializes in state-of-the-art semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Develop and qualify thermal material solutions, specifically Integrated Heat Spreaders (IHS), aligned with the technology roadmap.
• Define specifications for incoming materials to meet yield, reliability, quality, and cost targets.
• Create manufacturing design rules by balancing Design for Performance (DFP), Manufacturability (DFM), and Cost (DFC).
• Lead technical root cause analysis and problem solving for material issues during development and high-volume manufacturing.
• Continuously improve business processes and methodologies for high-performance thermal material solutions.

Requirements

• Bachelor's degree in Materials Science, Metallurgical, or Mechanical Engineering with 2+ years of relevant experience, OR a Master's degree in these fields.
• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
• Experience with mechanical design software such as SolidWorks or AutoCAD.
• Ability to work with mechanical drawings and Geometric Dimensioning and Tolerancing (GD&T).
• Must be based in or able to work from Phoenix, Arizona, US

Nice to have

• PhD degree in Materials Science, Metallurgical, or Mechanical Engineering.
• Experience leading technical innovation and managing complex, time-critical technical projects.
• Familiarity with high-precision metallic manufacturing, including stamping and CNC machining.
• Understanding of semiconductor fabrication processes and technologies.
• Experience with supply chain management in a manufacturing or materials qualification environment.

Culture & Benefits

• Comprehensive total compensation package including competitive pay and stock bonuses.
• Full benefit programs including health, retirement, and vacation.
• Hybrid work model allowing for a split between on-site and off-site work.