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17 часов назад

Process Integration Engineer (Semiconductor)

103 730 - 198 820$
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Process Integration Engineer (Semiconductor): Developing and defining integrated process flows for interconnect modules with an accent on RC performance optimization and yield improvement. Focus on performing root cause analysis of BE-driven yield loss and supporting the ramp from R&D to high-volume manufacturing.

Location: On-site presence required in Hillsboro, Oregon or Phoenix, Arizona, USA

Salary: $103,730 - $198,820

Company

hirify.global Foundry delivers process technology innovation to drive hirify.global's product roadmap and semiconductor manufacturing leadership.

What you will do

  • Develop and define integrated process flows for interconnect modules, coordinating across lithography, etch, deposition, and diffusion teams.
  • Optimize RC (resistance-capacitance) performance and establish process windows and integration schemes.
  • Identify and reduce BE-driven yield loss mechanisms using statistical tools such as SPC, DOE, and FMEA.
  • Implement control plans and process monitoring strategies using Cpk/Ppk and capability analysis.
  • Ensure reliability margins for electromigration, stress migration, and time-dependent via degradation.
  • Support the technology transfer and ramp from R&D to high-volume manufacturing (HVM).

Requirements

  • PhD degree in Electrical Engineering, Physics, Applied Physics, Material Science, Chemical Engineering, Mechanical Engineering, or a related discipline.
  • At least 6 months of experience in semiconductor device fabrication, nanotechnology, or clean room process development.
  • Experience with electrical characterization of transistors or other semiconductor devices.
  • Must be based in or be able to work on-site in Hillsboro, OR or Phoenix, AZ, USA.

Nice to have

  • Proficiency in JMP, MATLAB, Python, JSL, TCL, SQL, or C/C++.
  • Strong understanding of Device physics, including CMOS, FinFET, and GAA.
  • Hands-on experience in VLSI device fabrication and lab testing.
  • Knowledge of dry etcher, ALD, PE CVD, and metallization mechanisms.
  • Experience with automation and defect classification systems in a fab environment.

Culture & Benefits

  • Competitive total compensation package including salary, bonuses, and hirify.global stock awards.
  • Comprehensive medical plans, wellness programs, and health amenities.
  • Life and disability insurance.
  • Generous paid time off and recreational activities.
  • Collaborative and supportive environment focused on global technology innovation.

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