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2 дня назад

Field Application Engineer (Automotive Robotics)

Формат работы
remote (только Germany)
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Germany
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR

Field Application Engineer (Automotive Robotics): Driving adoption of the Open Chiplet Atlas ecosystem and providing technical support for AI platform integration with an accent on technical marketing and customer engagement within the semiconductor industry. Focus on managing technical tradeoffs between performance, cost, and interoperability for open standards.

Location: Remote, based out of Munich, Germany

Company

hirify.global is a leader in cutting-edge AI technology, developing high-performance RISC-V CPUs and an open chiplet ecosystem to redefine computing paradigms.

What you will do

  • Drive real adoption of the Open Chiplet Atlas initiative with strategic customers and partners.
  • Operate at the intersection of technology, ecosystem partners, and business strategy to align technical and business goals.
  • Manage and scale an industry-wide compliance and certification program for open standards.
  • Collaborate across technical and partner teams to ensure seamless integration of diverse IP and designs.
  • Influence technical and executive audiences through high-impact communication and presentations.

Requirements

  • Bachelor’s degree in Engineering, Computer Science, or equivalent practical experience.
  • 5+ years of experience in technical marketing, support, and customer engagement within the semiconductor industry.
  • Deep understanding of chiplet or SoC architecture, silicon design flows, and system-level tradeoffs.
  • Proficiency with HDLs (Verilog/VHDL) and industry-standard ASIC SoC design tools.
  • Familiarity with interconnect protocols (UCIe, AMBA) and standards bodies like PCI SIG or CXL Consortium.
  • Must be eligible to access U.S. export-controlled technology (compliance with EAR regulations).

Nice to have

  • MBA degree.
  • Experience working with open-source hardware projects.
  • Familiarity with advanced chip packaging technologies.

Culture & Benefits

  • Highly competitive compensation package and benefits.
  • Opportunity to work on groundbreaking RISC-V and chiplet technology.
  • Collaborative environment driven by curiosity and a commitment to solving hard problems.
  • Equal opportunity employer with a diverse team of technologists.

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