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4 дня назад

Senior Principal Engineer, Device Design (Semiconductor)

265 480 - 374 800$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Principal Engineer, Device Design (Semiconductor): Defining and optimizing next-generation and high-volume manufacturing semiconductor technologies across advanced logic, SRAM, low-power mobile, analog, and mixed-signal applications with an accent on device architecture, design rules, yield, and silicon-to-simulation readiness. Focus on leading cross-functional technology integration, resolving performance and reliability trade-offs, governing design rule waivers, and translating E-test and yield data into manufacturing and design decisions.

Location: Hybrid role based at an assigned hirify.global site in Hillsboro, Oregon; Santa Clara, California; or Phoenix, Arizona, United States.

Annual salary range: $265,480–$374,800 USD.

Company

hirify.global is transforming from an integrated device manufacturer into a global foundry service provider, delivering semiconductor manufacturing capabilities to external customers.

What you will do

  • Lead the architecture and technical definition of base and derivative semiconductor technologies, including transistors, interconnects, and design rules.
  • Guide customized technology development for high-performance logic, low-power, memory, analog, and mixed-signal applications.
  • Partner with customers, product design teams, Process Integration, Process Module, Device Physics, Yield Engineering, and Product Design groups.
  • Set device and interconnect performance targets and govern silicon-to-simulation readiness, model readiness, and manufacturing feasibility.
  • Direct design rule validation and waiver governance while balancing manufacturing compliance, yield, and product design flexibility.
  • Evaluate E-test and yield data using statistical methods and provide technical mentorship and industry leadership.

Requirements

  • Progressive semiconductor industry experience focused on CMOS device physics, device design, and semiconductor technology development.
  • Technical leadership experience leading cross-functional teams to define, develop, and deliver advanced semiconductor technologies and design rules into high-volume manufacturing.
  • Deep proficiency in design rule development, validation, and waiver management, including understanding of layout constraints and product yield.
  • Expertise in statistical data analysis, Design of Experiments, and interpretation of test chip, E-test, and yield trends.
  • Master’s degree in Electrical Engineering, Physics, Material Science, or a related field; PhD preferred.
  • 15+ years of relevant semiconductor device and technology development experience.
  • Successful completion of an extended background investigation is required, including education, SEC sanctions, and additional criminal and civil checks subject to applicable country law.

Nice to have

  • Architectural experience with advanced-node transistor design and scaling, including customization for low-power, analog, mixed-signal, and memory technologies.
  • Familiarity with physical verification flows, Design Rule Checker development, and mask generation concepts.
  • Extensive high-volume manufacturing experience with statistical process control and yield monitoring.
  • Exceptional written and verbal communication skills, including influencing executive stakeholders and guiding partners through technical trade-offs.

Culture & Benefits

  • Hybrid work model combining on-site work at an assigned hirify.global location with off-site work.
  • Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • Full-time employment as an experienced hire on Shift 1 in the United States.
  • Position of Trust subject to the required background investigation.

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