Senior Product Manager (Semiconductor)

Location: Shanghai (JingAn), China

Company

hirify.global develops semiconductor products and highly integrated package and system-in-package solutions.

What you will do

• Monitor market dynamics, technology trends, customer needs, competitor portfolios, supply-chain conditions, costs, and packaging roadmaps.
• Define product positioning, target markets, application scenarios, roadmaps, portfolio plans, and business priorities for multi-die package products.
• Lead system-level product definition covering package architecture, die partitioning, interconnection, pinout, power and signal integrity, thermal design, testing, reliability, and ecosystem requirements.
• Create and maintain MRDs, PRDs, product specifications, business plans, project requirements, competitive analyses, and executive decision materials.
• Lead feasibility studies, business cases, development reviews, risk management, validation, qualification, new product introduction, and the full lifecycle through mass production and end-of-life.
• Coordinate wafer suppliers, OSAT partners, substrate and lead-frame suppliers, test houses, internal teams, and ecosystem partners on capacity, quality, cost, and supply-risk management.

Requirements

• Bachelor’s degree or above in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline.
• At least 8 years of experience in semiconductor product management, product definition, system architecture, packaging engineering, application engineering, or related roles.
• Hands-on experience with multi-die packaging or system-in-package products integrating at least two of the following: MCU, gate driver, power device, power-management device, or memory device.
• Experience leading cross-functional semiconductor products from market opportunity and definition through development, qualification, mass production, and market launch.
• Strong understanding of MCU architecture, gate-driver functions, power semiconductors, power-management devices, memory technologies, system interactions, and application trade-offs.
• In-depth knowledge of packaging architecture, die attach, interconnects, substrates or lead frames, thermal management, signal and power integrity, assembly, testing, reliability, qualification, yield, and cost drivers.
• Strong market-analysis, customer-requirement, competitive-assessment, pricing, supply-chain, and business-potential evaluation skills.
• Strong cross-functional leadership, stakeholder management, commercial judgment, business-case, pricing, cost, margin, and portfolio-management capabilities.
• Fluent professional English for reading international technical documentation and participating in cross-border technical and business discussions.

Nice to have

• Master’s degree or MBA.

Culture & Benefits

• Full-time position based in Shanghai (JingAn), China.
• Cross-functional collaboration with design, packaging, test, quality, operations, suppliers, sales, and customers.
• Work includes international technical and business collaboration.