MEMS Semiconductor & Assembly Process Engineer (MEMS)

Location: Goleta, California, United States; onsite manufacturing role

Salary: USD 105,000–145,000 yearly

Company

hirify.global develops thermal imaging sensors and products, including MEMS-based infrared imaging solutions, for everyday and professional applications.

What you will do

• Own and sustain MEMS fabrication processes including PECVD and sputter deposition, photolithography, DRIE, wet etch, and sacrificial release.
• Develop and qualify wafer-level packaging and assembly processes including wafer bonding, getter activation, vacuum sealing, dicing, die attach, and wire bonding.
• Characterize bond interfaces and package hermeticity using SAM, IR microscopy, SEM/FIB cross-sections, and long-term vacuum-integrity monitoring.
• Design and run DOEs, apply SPC and statistical analysis with JMP and Python, and improve yield, Cpk, and cost.
• Manage outsourced process steps, supplier specifications, qualification lots, vendor data, and non-conforming material disposition.
• Drive root-cause analysis, containment, permanent corrective actions, and cross-functional support for new-product introduction and design-for-manufacturability reviews.

Requirements

• BS in Electrical or Mechanical Engineering, Materials Science, Physics, or a related field; MS preferred.
• 5+ years of hands-on process engineering experience in MEMS or semiconductor wafer fabrication, including at least 2 years in assembly or packaging such as wafer bonding, die attach, wire bonding, or hermetic sealing.
• Working knowledge of thin-film and etch processes and their interaction with downstream packaging, including stress, outgassing, and bonding surface preparation.
• Demonstrated production-environment experience with DOE, SPC, and FMEA.
• Ability to work in a cleanroom with gowning and interpret metrology and failure-analysis data.
• Clear written and verbal communication with suppliers, vendors, operators, and cross-functional engineering teams.
• Occasional travel to suppliers and contract manufacturers.
• U.S. Person status as defined by ITAR may be required depending on the product line.

Nice to have

• Experience with microbolometers or other vacuum-packaged MEMS infrared sensors.
• Wafer-level packaging experience, anti-reflective coatings, wafer defect identification, and yield corrective actions.
• Familiarity with MEMS reliability test methods and external foundry or supplier relationship management.
• Python or LabVIEW scripting for data handling and ISO 9001 quality-system experience.

Culture & Benefits

• Collaborative, high-performing engineering environment focused on accuracy, accountability, continuous improvement, and practical execution.
• Opportunity to work with engineers who pioneered thermal imaging technology and contribute to products shipped globally.
• Role operates in both cleanroom and non-cleanroom manufacturing environments and supports Production and Engineering.