Mechanical Engineer IV (Semiconductor Equipment)

Location: Santa Clara, CA, United States; onsite role with 20% travel. Relocation eligible.

Salary: $147,000–$202,500 per year

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Lead the design, development, qualification, and lifecycle improvement of PVD chambers, targets, cathodes, shields, liners, pedestals, ESCs, process kits, wafer-handling interfaces, and vacuum hardware.
• Create 3D designs, 2D drawings, GD&T documentation, tolerance analyses, specifications, and engineering calculations.
• Perform thermal, structural, vibration, and design tradeoff analyses using FEA/CFD tools.
• Develop solutions for contamination control, particle reduction, thermal stability, reliability, and manufacturability.
• Collaborate with process, RF, electrical, systems, manufacturing, and quality teams; coordinate suppliers and component qualification.
• Lead root-cause investigations, corrective actions, qualification plans, engineering test-data analysis, and resolution of customer and field issues.

Requirements

• BS/MS degree in Mechanical Engineering or a related field.
• 5–10 years of mechanical design experience.
• Strong CAD, GD&T, tolerance stack-up, and drawing creation skills.
• Experience with vacuum systems, thermal management, precision assemblies, and product development.
• Ability to generate specifications, test plans, and engineering reports.
• Strong troubleshooting and root-cause analysis skills.
• Deep expertise in mechanical design and semiconductor equipment hardware, with the ability to independently drive complex engineering programs with minimal supervision.
• Ability to lead multidisciplinary technical problem solving, influence design decisions, establish best practices, and communicate with customers, suppliers, and senior leadership.

Nice to have

• Direct PVD experience with process chambers, cathodes, targets, magnetrons, shields, process kits, pedestals, and ESCs.
• Understanding of plasma processes, vacuum technology, contamination control, and thermal management.
• Experience with advanced packaging, logic, or memory applications.
• Knowledge of RF hardware integration and high-temperature components.
• Experience with NX, Teamcenter, ANSYS, and engineering change processes.

Culture & Benefits

• Supportive culture focused on learning, professional development, and career growth.
• Health and wellbeing programs with a comprehensive benefits package.
• Regular employee position with full-time hours.
• Travel required for 20% of the time.