Photonics Packaging & Cryogenic Integration R&D Engineer (Quantum Computing)

Location: Hybrid, with 3–4 days per week onsite in Massy, 1 day in Paris, or 1–2 days remotely; France

Company

hirify.global develops photonic quantum computers, full-stack cloud quantum computing solutions, and algorithm access services for research and industrial customers.

What you will do

• Design and develop packaging and integration solutions for photonic and quantum devices, including single-photon sources, photonic integrated circuits, and optical components.
• Develop optical coupling strategies, precision positioning and alignment systems, nano-positioning stages, and multi-axis platforms.
• Build experimental setups operating at cryogenic temperatures, typically 2–4 K, and design mechanical parts and assemblies using CAD tools.
• Contribute to electronics, PCB, instrumentation, microcontroller, FPGA, and hardware-control development.
• Automate alignment, testing, and characterization using Python, C++, Rust, or similar languages.
• Prototype, test, optimize, document, and transfer laboratory systems toward repeatable and scalable manufacturing.

Requirements

• PhD in electrical engineering, mechanical engineering, applied physics, condensed matter physics, solid-state physics, optics, photonics, or a related field.
• Strong hands-on experience building and testing scientific or high-precision equipment.
• Experience with photonics, optomechanics, semiconductor devices, cryogenics, or precision engineering.
• Familiarity with optical alignment, fiber coupling, and/or photonic packaging.
• Experience with mechanical design and CAD tools.
• Good understanding of electronics, instrumentation, and test equipment.
• Programming skills in Python, C++, Rust, or similar languages for automation and hardware control.
• Experience working with multidisciplinary systems combining optics, mechanics, electronics, and software.
• Strong experimental problem-solving skills, rapid prototyping ability, and excellent written and spoken English for technical documentation and international collaboration.

Nice to have

• Experience with cryogenic systems, photonic or optoelectronic packaging, chip bonding, indium bump bonding, or micro-assembly.
• Experience with pick-and-place systems, automated precision assembly, nano-positioning, or multi-axis motion control.
• Experience with robotics, computer vision, FPGA, microcontroller development, or PCB design using KiCad or similar tools.
• Experience with finite-element simulation using ANSYS, COMSOL, or similar tools.
• Experience in semiconductor or quantum photonics environments.

Culture & Benefits

• Hybrid work model with regular onsite work in Massy and additional work in Paris or remotely.
• Company savings plan and 100% health coverage through Alan.
• 50% transport reimbursement or sustainable mobility bonus.
• Meal vouchers, Gymlib fitness support, childcare assistance, and referral bonuses of €1,000–€2,000.
• Ownership from day one, close collaboration, and exposure to the full quantum stack from high-level APIs to low-level firmware.

Hiring process

• Talent Acquisition interview followed by a Hiring Managers interview.
• Live use case or take-home use case presented afterward, followed by meetings with the teams.
• Two to three reference checks and an offer; the process may evolve depending on the role.