Process Engineer, Thin Films

Location: Marcy, New York, United States of America

Salary: $70,000–$97,000 per year

Company

hirify.global develops and manufactures silicon carbide semiconductor technologies in a highly automated wafer fabrication environment.

What you will do

• Develop, qualify, and optimize thin-film processes and equipment for silicon carbide wafer fabrication.
• Drive improvements in technical performance, manufacturing yield, process efficiency, and product quality.
• Define and execute Design of Experiments (DoE), analyze data with statistical methods, and use results to improve processes.
• Apply predictive failure-mode identification and automotive-standard problem-solving methods to technology introduction and sustaining activities.
• Present technical data and project updates to peers and management.
• Travel occasionally to manufacturing sites and vendor locations to learn and share knowledge.

Requirements

• BS in Electrical Engineering, Chemical Engineering, Materials Science, or an equivalent field.
• Knowledge of processes and equipment used in semiconductor fabrication.
• Proficiency in technical writing and presentations.

Culture & Benefits

• Innovation-focused environment with an emphasis on removing roadblocks and improving execution.
• Childcare assistance and paid parental leave.
• Continuing education assistance.
• Employee Resource Groups and local community outreach opportunities.
• Full-time employment with occasional travel to manufacturing sites and vendors.