Power Lead, Power Delivery Systems (AI)

Location: Fully onsite in Boston, Massachusetts, United States

Salary: $150,000–$220,000 base salary plus founding-team equity

Company

Early-stage semiconductor startup developing next-generation power delivery technology and a 3D heterogeneous integration platform combining silicon, GaN power devices, and advanced packaging for high-performance computing and advanced semiconductor systems.

What you will do

• Define the vertical power delivery architecture from first principles and take ownership of complex engineering challenges.
• Lead development of highly efficient power systems from initial design through tape-out and production.
• Develop power delivery systems for high-performance computing, AI data centers, and next-generation compute infrastructure.
• Work directly with hyperscaler and AI accelerator partners.
• Help build a new 3D heterogeneous integration platform combining silicon, GaN power devices, and advanced packaging technologies.

Requirements

• MS with 8+ years or PhD with 5+ years of relevant experience, or equivalent practical experience.
• Strong experience with power electronics and power delivery systems for high-performance computing or data centers.
• Deep understanding of 48V power architectures, point-of-load conversion, and vertical power delivery.
• Experience with GaN power devices, high-frequency converters, and power integrity.
• Proven experience taking power delivery products from architecture through tape-out, validation, and qualification.

Nice to have

• Experience with advanced packaging, co-packaged power stages, or hyperscaler power systems.

Culture & Benefits

• Founding technical lead opportunity at an early-stage startup.
• Founding-team equity.
• Full onsite work in Boston, Massachusetts.