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8 дней назад

QPU Integration Engineer (Micro-Fabrication focused) (f/m/d)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
c1
Страна
Germany
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
QPU Integration Engineer (Micro-Fabrication focused) (f/m/d) (Quantum Hardware/Microfabrication): Integrating and optimizing FEOL and BEOL fabrication flows for next-generation trapped-ion quantum processor architectures with an accent on cleanroom processing, yield optimization, and technology transfer. Focus on translating QPU designs into manufacturable process flows, managing internal and external fabrication, and solving integration failures through SPC, DOE, PFMEA, and root-cause analysis.

Location: Hamburg, Germany; onsite

Company

hirify.global develops and operates full-stack quantum computers based on trapped-ion technology, combining laser-cooled trapped ions with microwave control and tailored magnetic fields.

What you will do

  • Act as the technical expert for FEOL and BEOL fabrication modules, including lithography, thin-film deposition, etching, dielectric isolation, passivation, and interconnects.
  • Lead end-to-end integration of multilayer QPU architectures and translate design requirements into manufacturable design rules and process design kits.
  • Manage daily internal cleanroom fabrication, process baselines, run schedules, deviations, metrology, yield analysis, and design feedback.
  • Lead R&D projects for new materials, geometries, and process steps, including process transfer and yield matching with external foundries and research institutes.
  • Drive RCA, PFMEA, SPC, process-window definition, and failure resolution for integration issues and performance degradation.
  • Mentor junior engineers and technicians and author process specifications, SOPs, and technical roadmaps.

Requirements

  • Master’s or Ph.D. in Microelectronics, Electrical Engineering, Materials Science, Applied Physics, Nanotechnology, or a related field.
  • At least 5 years, or equivalent extensive industry experience, in hands-on semiconductor or quantum hardware integration in a professional Class 10/100 or ISO 4–5 cleanroom.
  • Deep FEOL and BEOL expertise, including e-beam or optical lithography, PVD/ALD thin films, RIE/DRIE, planarization, lift-off, and flip-chip or interconnect technologies.
  • Experience taking complex solid-state micro/nano devices from R&D concept to stable, repeatable integration flows.
  • Experience managing joint development projects or technology transfers with commercial foundries or external fabrication partners.
  • Strong project management skills covering timelines, deliverables, and milestones.
  • Knowledge of SPC, DOE, PFMEA, and structured RCA methods such as 8D and Fishbone.
  • Proficiency with layout and data tools such as KLayout, Cadence, and Python or MATLAB for yield and parametric analysis.
  • Fluent English, written and spoken, with excellent technical writing and presentation skills.

Nice to have

  • Quantum hardware integration experience with superconducting circuits, trapped-ion traps, spin qubits, or photonic chips.
  • Experience with low-loss dielectrics, superconducting interconnects, 3D integration, or TSV technologies.
  • Experience establishing cleanroom process baselines or setting up new process lines and tools from scratch.
  • Experience managing foundry contracts, IP considerations, and wafer delivery schedules.

Culture & Benefits

  • Full-time permanent employment with flexible working hours.
  • Competitive salary with additional achievement-based rewards.
  • International and diverse team with regular team events.
  • Individualized training and personal development opportunities.
  • Health-promoting benefits, bike leasing, moving support, and modern laboratory and office infrastructure.
  • Work at the intersection of academic research and commercial quantum-computing applications.

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