SiP Package Development Specialist (m/f/d) (Automotive)

Location: Regensburg, Germany; hybrid and cross-border mobile work are possible.

Company

hirify.global is an independent automotive technology and electronics company developing sensor solutions, displays, braking and comfort systems, software, architecture platforms, and assistance systems for software-defined vehicles.

What you will do

• Define technically viable and cost-effective System-in-Package concepts using bare-die known-good-die components, passives, and future multi-vendor chiplets.
• Select and assess package architectures, substrates, interposers, materials, interconnects, and assembly processes for product requirements.
• Develop and compare 2D, 2.5D, and 3D SiP concepts, including stack-ups, die placement, bump and pad concepts, assembly flows, and design rules.
• Lead package technology trade-off studies covering performance, size, thermal behavior, reliability, manufacturability, yield, schedule, supply risk, and cost.
• Coordinate feasibility studies, concept reviews, simulations, prototype planning, and failure analysis with assembly and test providers, suppliers, foundries, pilot lines, and engineering partners.
• Establish package specifications, bills of material, technical decision records, reusable design guidelines, and inputs for the AESS SiP technology roadmap.

Requirements

• Academic degree in Electrical Engineering, Microelectronics, or a comparable qualification.
• In-depth semiconductor technology experience and long-term experience with IC design methodology and EDA tools.
• Several years of experience in semiconductor package development, advanced packaging, System-in-Package, or heterogeneous integration.
• In-depth knowledge of package substrates, redistribution layers, interposers, die attach, wire bonding, flip chip, micro-bumps, underfills, molding compounds, and thermal interface materials.
• Profound experience with package architecture trade-offs involving electrical, thermal, mechanical, reliability, manufacturability, and cost constraints.
• Experience working with outsourced semiconductor assembly and test providers, substrate suppliers, foundries, or semiconductor pilot lines.
• Deep knowledge of package design rules, assembly process flows, design for manufacturability, and package qualification principles.
• System thinking, technical judgment, partner management, documentation discipline, customer focus, initiative, adaptability, communication skills, and teamwork.
• Business-fluent English is required; German is desirable.

Nice to have

• Knowledge of automotive semiconductor reliability expectations and relevant qualification and quality methods.
• Experience in technical supplier assessment, feasibility studies, and structured risk analysis.

Culture & Benefits

• Hybrid and cross-border mobile work, flexible working-time models, part-time work, and sabbatical options.
• Benefits include canteens and cafeterias, continuing education and training, health management, and physiotherapy.
• Work in a highly motivated team on diverse projects in the global automotive industry.
• Support for work-life balance, lifelong learning, and personal and professional development.
• Applications from severely handicapped people are welcome.