Software Engineering Intern, Connectivity - HP IQ (AI)

Location: San Francisco, California, United States of America

Hourly pay: $40.00–$50.00 per hour

Company

hirify.global IQ's Connectivity Software team develops foundational software for connected experiences across devices and platforms.

What you will do

• Develop on-device firmware and system software in C, C++, or Python.
• Build software supporting wireless connectivity across multiple devices and platforms.
• Design and implement device discovery and pairing protocols.
• Optimize machine learning inference and develop sensing algorithms for ambient and wearable interactions.
• Debug issues across wireless stacks, operating-system integration, and application-level code.
• Collaborate with hardware and software engineers, participate in design reviews, and contribute to testing, validation, and documentation.

Requirements

• Ability to write efficient on-device firmware and system software in C, C++, or Python for Wi-Fi and Bluetooth connectivity across multiple device types.
• Experience designing and implementing device-to-device discovery and pairing protocols for enterprise and consumer environments.
• Ability to optimize machine learning inference on resource-constrained devices while balancing accuracy, power consumption, and latency.
• Ability to develop sensing algorithms using data and AI techniques for ambient and wearable interactions.
• Ability to debug complex issues spanning wireless stacks, operating-system integration, and application-level code.
• Ability to collaborate with hardware engineers, system software teams, and product managers to translate requirements into technical solutions.
• Participation in code reviews, technical design discussions, testing, validation, and documentation of connectivity features and firmware updates.

Nice to have

• Previous experience with edge machine learning or AI inference on embedded devices.
• Familiarity with IoT or ambient computing.
• Experience shipping consumer software products from development through production.
• Background in IoT, wearable, or mobile device development.
• Exposure to agentic workflows or multi-device ecosystem design.

Culture & Benefits

• Full-time internship program scheduled for May/June–August/September 2027, with final dates based on student schedules.
• Health, dental, and vision insurance.
• Short- and long-term disability insurance, life insurance, employee assistance program, and flexible spending account.
• Four to twelve weeks of fully paid parental leave based on tenure, 11 paid holidays, and additional paid vacation and sick leave.