Software Engineer, New College Grad- Master's (Semiconductor Equipment)

Location: Chandler, AZ, United States; travel required up to 10% of the time; relocation eligible.

Salary: $108,000.00–$148,500.00 per year.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays, including technologies supporting AI and next-generation semiconductor commercialization.

What you will do

• Design, prototype, and develop moderately complex software for semiconductor equipment components and devices.
• Design common software modules and libraries for use across multiple products.
• Develop software documentation and test procedures.
• Troubleshoot moderately difficult software problems and implement bug fixes.
• Communicate with internal and external customers to analyze requirements, plan project schedules, and troubleshoot software.

Requirements

• Master’s degree in a related field, such as computer science, information management, software or systems engineering, cybersecurity, or mathematics.
• Preferred GPA of 3.0 or above.
• Proficiency in C/C++, .NET, C#, operating systems, networking principles, algorithms, and multi-threading.
• Proficiency in Agile development and rapid prototyping.
• Strong object-oriented programming, object-oriented design, and design pattern skills.
• Familiarity with WCF and Windows Forms UIs.

Nice to have

• Experience with Python and AI/ML platforms and tools.
• Semiconductor industry experience.
• Strong conceptual knowledge of software engineering and willingness to expand capabilities.
• Understanding of the semiconductor industry’s key business drivers.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Health and wellbeing programs and support for personal and professional growth.
• Comprehensive benefits package.
• Potential eligibility for bonus and stock award programs, as applicable.

Hiring process

• Applications are reviewed on a rolling basis.
• Applications should be submitted by November 30, 2026; the position may close early based on application volume or candidate selection.