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2 дня назад

Process Support Engineer III (Semiconductor)

108 000 - 148 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Support Engineer III (Semiconductor): Guiding semiconductor products through qualification and lifecycle support by diagnosing complex equipment and process issues, developing experiments, and analyzing manufacturing data with an accent on customer-facing technical leadership, fab operations, and process engineering. Focus on leading cross-functional programs, performing root cause analysis, managing risks and escalations, and delivering yield, uptime, cycle-time, and cost-of-ownership improvements.

Location: Based in Boise, Idaho, with regular interaction across fab, account, and corporate teams; quarterly customer travel and approximately 25% travel required.

Salary: $108,000.00–$148,500.00 per year.

Company

hirify.global develops and services materials science and engineering solutions, equipment, and processes used in semiconductor chip and advanced display manufacturing.

What you will do

  • Act as the primary customer-facing technical lead for global fab operations, resolving complex equipment and process issues.
  • Lead cross-functional technical programs across multiple tools or process areas, managing scope, milestones, risks, priorities, and success metrics.
  • Translate customer technical and operational needs into execution plans, roadmaps, and prioritized actions.
  • Develop hypothesis experiments and design of experiments, analyze data statistically, and compile reports with high-level conclusions.
  • Perform troubleshooting and root cause analysis while resolving difficult process engineering and customer product issues.
  • Drive measurable customer value through yield improvement, uptime gains, cycle-time reduction, and cost-of-ownership improvements.

Requirements

  • Bachelor’s degree in Chemistry, Physics, Materials Engineering, Electrical Engineering, Optoelectronics, or a related field.
  • 3–5 years of experience in semiconductor manufacturing, process engineering, equipment engineering, or fab operations.
  • Independent-contributor experience owning technical programs or cross-functional initiatives in customer-facing or on-site roles.
  • Solid understanding of fab operations, qualification flows, and manufacturing constraints in high-volume or advanced-node environments.
  • Strong communication and stakeholder-management skills, including the ability to influence and drive decisions independently.
  • Proven effectiveness in a matrix environment, balancing autonomy with teamwork and collaboration.
  • Ability to work across technology, operations, and business, including prioritization, escalation management, and value discussions.
  • Proficiency in presentation development and data visualization, including PowerPoint, Power BI, and Tableau.

Culture & Benefits

  • Supportive work culture focused on learning, development, career growth, and innovative customer solutions.
  • Comprehensive benefits supporting employee health and wellbeing.
  • Regular employee status with full-time employment.
  • Eligible candidates may receive bonus and stock-award compensation, where applicable.
  • Relocation eligible; travel is required approximately 25% of the time.

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