Manager, Mechanical Engineering and Technical Lead (PSP) (Semiconductor Wet Processing)

Location: US - PA - Horsham; onsite role.

Salary: $128,000-$188,000 per year, plus a bonus opportunity.

Company

hirify.global designs, develops, manufactures, and services complex machines used to produce devices for semiconductor, communications, computing, and other advanced technology applications.

What you will do

• Lead, coach, and develop the mechanical engineering team while contributing directly to complex and business-critical technical work.
• Own the mechanical architecture of wet processing equipment, including concept development, design reviews, calculations, material and component selection, prototype evaluation, and troubleshooting.
• Resolve build, test, and field issues with engineering and manufacturing teams through root cause analysis and hands-on hardware investigation.
• Develop mechanical solutions for chemistry delivery, wafer tooling, process chambers, automation interfaces, and structural frames that meet performance, safety, quality, cost, manufacturability, and serviceability requirements.
• Identify technical risks, remove design roadblocks, make engineering tradeoffs, and control mechanical changes through the product lifecycle.
• Partner with Process, Electrical, Software, Operations, Supply Chain, Marketing, and Service teams to translate customer and product requirements into integrated equipment designs.

Requirements

• Bachelor’s degree in Mechanical Engineering and at least 8 years of professional mechanical engineering experience, or a Master’s degree in Mechanical Engineering and at least 6 years of professional mechanical engineering experience.
• At least 3 years of people management experience with direct reports.
• Experience designing mechanical systems for complex capital equipment across multiple phases of the product development lifecycle.
• Ability to lead as a player-coach, combining team coaching and resource decisions with design reviews, technical calculations, prototype work, and hands-on troubleshooting.
• Deep mechanical design judgment in complex capital equipment.
• Working knowledge of electromechanical system architecture and interfaces among mechanical hardware, controls, sensors, automation, and process requirements.
• Experience selecting materials and surface finishes for aggressive chemical environments.
• Experience applying Failure Modes and Effects Analysis, technical risk evaluation, and root cause and corrective action methods.
• Ability to design for safety, manufacturing, and serviceability and translate complex technical issues into clear decisions and next steps.

Nice to have

• Experience with semiconductor wet processing, single-wafer equipment, chemistry delivery, or related process equipment.
• Familiarity with wet processing chemistries and cleanroom environments.

Culture & Benefits

• Medical, dental, and vision coverage.
• 401(k) with company match, flexible spending accounts, commuter benefits, and tuition reimbursement.
• Holiday, vacation, and sick time.
• Life and accident insurance, disability insurance, employee assistance, identity theft remediation, and emergency travel assistance.
• Multiple interviews with several team members, conducted in person or virtually; references or a background investigation may be part of the offer process.