Process Development Engineer (Microwave/RF Manufacturing)
Контакты
58 700 - 78 300$
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
solidworksrflean manufacturingspcelectronics manufacturingmicrowavepfmeawire bondingdie attachthin film hybrid assembly
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
Малоразвернуть
$59к-78к/год
$94к$110кмедиана$120к
По похожим ролям (49) ~ $110к/год
71
Хорошая вакансия
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Обязанности инженера-технолога и требования к опыту описаны ясно, а работа связана со специализированным производством для аэрокосмической и оборонной отраслей; офисный формат и допуск сужают круг тех, кому подойдет вакансия.
Оплата ниже рынка
Понятные задачи
Оборонные технологии
?Нужен допуск
Мэтч & Сопровод
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Process Development Engineer (Microwave/RF Manufacturing): Developing and improving thin-film hybrid assembly and microwave/RF manufacturing processes with an accent on eutectic and epoxy attach, wire bonding, die attach, tooling, and production transfer. Focus on troubleshooting assembly issues, performing root cause analysis, applying Lean, PFMEA, and SPC, and supporting mission-critical aerospace, defense, and communications products.
Location: Mountain View, California, United States; onsite. Must be a U.S. citizen and able to obtain and maintain a government security clearance.
Salary: $58,700–$78,300 per year.
Company
hirify.global, part of Teledyne Technologies, develops high-reliability technologies and microwave/RF components for aerospace, defense, communications, aviation, radar, Satcom, space, and electronic warfare applications.
What you will do
Provide process engineering support for thin-film hybrid assembly and MIC processes.
Support eutectic attach, epoxy attach, bond pull, gap welding, sealing, and painting assembly methods.
Troubleshoot new assembly processes, resolve in-process technical issues, and perform root cause analysis.
Participate in process development, research, continuous improvement, and new product development, with emphasis on auto wire-bonding and die attach.
Generate ECOs, maintain assembly documentation, lead process transfers from NPI to production, and design tooling using CAD software.
Analyze production data and implement solutions using Lean, PFMEA, and SPC methodologies.
Requirements
Bachelor’s degree in engineering or equivalent and at least 1 year of experience in electronics manufacturing are required.
Familiarity with AS9100/ISO9001 standards and lean manufacturing principles is required.
Proficiency in Microsoft Office.
Strong analytical, problem-solving, and communication skills are required.
U.S. citizenship and the ability to obtain and maintain a government security clearance are required.
Nice to have
Background in electronics assembly processes such as wire bonding and die attach.
Knowledge of process tooling design and application.
SolidWorks experience.
Culture & Benefits
Competitive pay and comprehensive health benefits.
401(k) with company match and retirement plans.
Paid time off and flexible work arrangements.
Professional development and training opportunities.
Employee wellness programs and assistance resources.
Collaborative work on mission-critical technology.
Hiring process
Apply online through Teledyne’s careers page.
Selected candidates will be contacted for interviews and guided through the security-clearance process.
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