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2 дня назад

Software Engineer III (Semiconductor Manufacturing)

132 000 - 181 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Software Engineer III (Semiconductor Manufacturing): Designing and developing control software for semiconductor manufacturing equipment with an accent on machine control, robotics, motion systems, vision, and factory automation. Focus on integrating electromechanical systems, debugging equipment interfaces, validating software, and supporting customer installations and factory acceptance testing.

Location: Austin, TX or Santa Clara, CA, United States; domestic and international travel up to 10%.

Salary: $132,000.00–$181,500.00 per year.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays, including technologies supporting AI.

What you will do

  • Design, develop, test, and maintain software for semiconductor manufacturing equipment.
  • Develop machine control applications using object-oriented design principles and modern software architectures.
  • Implement control software for motion control, robotics and automation, laser processing, vision and metrology, and factory automation interfaces.
  • Collaborate with systems, electrical, and mechanical engineers to define equipment requirements and software architecture.
  • Develop interfaces to PLCs, motion controllers, sensors, and process hardware; support equipment integration, debugging, and validation.
  • Participate in design and code reviews, software verification, field issue investigation, corrective actions, technical documentation, software releases, customer installations, and factory acceptance testing.

Requirements

  • Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, Software Engineering, Mechatronics Engineering, or a related engineering discipline.
  • 5+ years of software development experience.
  • Experience developing software in C# or C++.
  • Experience with object-oriented design and software architecture.
  • Experience with source control systems such as Git, Azure DevOps, SVN, or an equivalent.
  • Experience troubleshooting complex electromechanical systems, with strong debugging and problem-solving skills.
  • Ability to work effectively in a cross-functional engineering environment.
  • Ability to demonstrate ownership and accountability, drive issues to closure with minimal supervision, communicate technical information across engineering disciplines, mentor junior engineers, and support safety, quality, and continuous improvement.

Nice to have

  • Semiconductor equipment experience; Beckhoff TwinCAT; EtherCAT; PLC programming; automation systems; motion control platforms such as Aerotech, Beckhoff, Delta Tau, ACS, or Siemens.
  • Vision systems integration, SECS/GEM, OPC-UA, real-time control systems, robotics and precision automation, laser processing equipment, advanced packaging or photonics manufacturing, and Agile methodologies.
  • Experience with Python, Structured Text (IEC 61131-3), Windows, Visual Studio, Ethernet/IP, TCP/IP, RS-232, motion control, precision positioning, machine vision, or semiconductor manufacturing equipment.

Culture & Benefits

  • Supportive work culture focused on learning, development, career growth, innovation, safety, quality, and continuous improvement.
  • Comprehensive benefits package with programs supporting employee health and wellbeing.
  • Selected candidates may be eligible for bonus and stock award programs, as applicable.
  • Relocation eligible.

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