Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Чётко описанная стажировка у крупного производителя полупроводников даёт практический опыт в tapeout, наставничество и понятную программу развития; очный формат с полной занятостью ограничивает гибкость.
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Полная занятость на местеНаставничество и развитиеОпыт в полупроводникахПонятные задачи
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Tapeout Engineering Intern, Tapeout Operations (Summer 2027) (Semiconductor Manufacturing): Supporting final verification and release of customer semiconductor designs to manufacturing with an accent on automation scripts, tapeout workflow analysis, and process metrics. Focus on identifying bottlenecks, performing root cause analysis, and improving tapeout quality and cycle time.
Location: Essex Junction, Vermont, United States; full-time, onsite internship requiring at least 40 hours per week.
Expected salary: $20.00–$40.00 per hour. A second listed range of $0.00–$0.00 is not treated as the expected salary.
Company
hirify.global manufactures essential semiconductors and develops power-efficient, high-performance solutions for high-growth markets including AI.
What you will do
Support final verification and release of customer semiconductor designs to manufacturing with experienced Tapeout Engineers.
Develop and improve automation scripts and tools for data handling and job submission.
Collaborate with design, manufacturing, and IT teams.
Analyze and document tapeout workflows, process metrics, and bottlenecks.
Participate in root cause analysis and corrective actions for tapeout-related issues.
Maintain process documentation and standard operating procedures while following Environmental, Health, Safety & Security requirements.
Requirements
Be at least a sophomore at the time of application and actively pursue a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Physics, or a related field through an accredited degree program during the internship.
Have an overall GPA of at least 3.0 and remain in good academic standing.
Have written and verbal fluency in English.
Be able to work at least 40 hours per week during the internship.
Nice to have
Prior related internship or co-op experience.
Leadership experience in the workplace, school projects, or competitions.
Strong interest in using AI tools and emerging technologies to improve productivity, workflows, and decision-making.
Project management skills, including innovation, execution, and navigating ambiguity.
Strong written and verbal communication, planning, organizational, analytical, and problem-solving skills.
Proficiency in Microsoft Excel or other data analysis tools; experience with Linux/Unix environments, scripting languages such as Python, Perl, or Shell, and version control systems.
Knowledge of Lean or Six Sigma process improvement methodologies.
Basic understanding of semiconductor design or manufacturing processes.
Culture & Benefits
One-on-one mentorship and work assignments focused on professional growth.
Professional development opportunities and networking with executives.
Hands-on exposure to industry-leading EDA tools, foundry tapeout processes, advanced technologies, and semiconductor manufacturing.
Participation in a global entry-level talent pipeline for interns and co-ops.
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